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eBOX671-517-FL-DC

Tuotenro
eBOX671-517-FL-DC
Toimitusaika 21-30pv
Fanless System, 6/7th Gen Intel Core i7/i5/i3 Processor, Intel Q170, 8x PoE, 2 GbE LAN, 6 USB, 2COM, 24VDC
Ominaisuudet
* 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W) and Intel® Q170
* 8-CH PoE/GbE onboard
* 2 front-access SIM slots
* Supports 6-in/2-out isolated DIO
* -40°C to +70°C extended operating temperature
* Optional ignition feature supported
Spesifikaatiot
System
Processor LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
CPU Performance
Security Hardware
Chipset Intel® Q170
Storage 2 x 2.5" HDD drive bay
1 x mSATA
Storage Support
Memory 2 x 260-pin DDR4-2666 SO-DIMM, up to 32GB
Memory (RAM)
I/O Ports
USB 2.0 2 x USB2.0
USB 3.0 4x USB 3.0
Serial 2x RS-232/422/485
Display 1 x HDMI 1.4b
1 x VGA
1 x DVI-D
Ethernet 8 x Gigabit PoE (IEEE 802.3at) port (Intel® i211-AT, max. up to 90W)
Other Ports Line-out & MIC-in
1 x 6-in/2-out isolated DIO
Operating System
Operating System Windows 10 Pro, Windows 10 IoT, Linux
Power
DC Input / Source Voltage 24V DC
Power Management
Expansion Slots
Expansion 2 x Full-size PCI Express Mini Card slot (USB + PCIe + SIM)
1 x Half-size PCI Express Mini Card slot (USB only)
1 x Half-size PCI Express Mini Card slot (USB + PCIe + mSATA)


Operating Temperature
Operating Temperature -40°C to 70°C (with W.T. DRAM & SSD, CPU TDP 35W)
-40°C to 55°C (with W.T. DRAM & SSD, CPU TDP 65W)
Humidity Range 10% to 95% non-condensing
Cooling System / Thermal Solution
Thermal Solution Passive - Fanless
Dimensions / Weight
Weight (kg) 4.4 kg   
Dimensions 280 x 210 x 80.0 mm
Enclosure
Bezel
Material Aluminum/
Mounting Wall mount kit, DIN-rail kit
Vibration
Peripherals & Devices
Accessories
Extra Features
Certification
Certification CE / FCC