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DI-1200
SKU
DI-1200
Coming
Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer
- Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
- 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
- Quad Independent Display (2x DP/HDMI/CMI Display)
- 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
- 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
- CMI Technology for Optional I/O Module Expansions
- CFM Technology for Power Ignition Sensing Function & PoE
- Wide Operating Temperature -40°C to 70°C
| System | |
| Processor | Onboard 12th Intel® Alder Lake-P U-Series CPU: - Intel® Core™ i7-1265UE 10 Cores Up to 4.70 GHz, TDP 15W - Intel® Core™ i5-1245UE 10 Cores Up to 4.40 GHz, TDP 15W - Intel® Core™ i3-1215UE 6 Cores Up to 4.40 GHz, TDP 15W |
| Security Hardware | |
| Chipset | SoC |
| Storage | 1x 2.5” SATA HDD/SSD Bay 1 x M.2 SSD shared by M.2 Key B Type 3052 Socket Support RAID 0/1 |
| Storage Support | |
| Memory | 1x DDR5 SO-DIMM Socket, Support Up to 32GB |
| Graphics | Integrated Intel® Iris® Xe Graphics: Core™ i7-1265UE,
i5-1245UE Integrated Intel® UHD Graphics: Core™ i3-1215UE |
| I/O Ports | |
| USB 2.0 | 3 x USB2.0 |
| USB 3.0 | 2x USB 3.2 (5Gbs) 1x USB 3.2 (10Gbs) |
| Serial | 2x RS-232/422/485 |
| Video | 1 x HDMI 2 x DisplayPort Optional: DP, HDMI or VGA (4th monitor) |
| Ethernet | 2x GbE LAN , RJ-45 |
| Other Ports | Mic-in/Line-out 1x Remote Power On/Off Connector 1x Remote Power LED |
| Expansion | |
| Expansion Interface | 1x CFM Interface (Control Function Module) 1x CMI (Combined Multiple I/O) (for extra LAN module) 1x CMI (Combined Multiple I/O) (for extra COM/DIO module) 1x M.2 Key E type 2230 Socket, Support Wireless 1x M.2 Key B type 3042/3052 Socket, Support 5G/Storage/Add-on Card expansion 2x SIM Socket |
| Operating System | |
| Operating System | Windows® 10 |
| Power | |
| DC Input / Source Voltage | Power Input Voltage 9~48VDC |
| Cooling System / Thermal Solution | |
| Thermal Solution | Passive - Fanless |
| Dimensions / Weight | |
| Weight (kg) | 1.8 kg |
| Dimensions | 203 x 142 x 67 mm |
| Environment & Reliability | |
| Power protection | Reverse Power input protection |
| Over Voltage, Over Current | |
| MTBF | 486,235 h |
| Operating Temperature | -40°C ~ +70°C with W.T. SSD, 15W TDP CPU |
| Humidity Range | 10% ~ 95%, non-condensing |
| Shock | MIL-STD-810H |
| Vibration | MIL-STD-810H |
| EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN 61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
| EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV • EN/IEC 61000-4-6 CS: 10V (**Compliant with the standard when utilizing shielded cable.) • EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz |
| Enclosure | |
| Material | Aluminum / Steel |
| Mounting | Desk / Wall mounting / DIN-Rail/ VESA mount |
| Design guide | • Fanless Design • Cableless Design • Jumper-less Design • Unibody Design |
| Peripherals & Devices | |
| Accessories | Optional Modules |
| Extra Features | |
| Certification | |
| Certification | CE, UKCA, FCC, ICES-003 Class A • EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only) • EN 50155 (EN 50121-3-2 Only) • E-mark |
| Manufacturer / Brand | Cincoze |
|---|---|
| Cooling | Fanless |
| CPU Family | Alder Lake (12th Gen Core i3/i5i7/i9) |
| Operating Temp | Wide Temp -40..70C |