Advantech

Small Size DIN-rail IPC with Intel® Atom™ E3845

• Intel® Atom E3845 1.91GHz processor with 4GB DDR3L Memory
• 3 x GbE, 3 x USB, 2 x COM, 1 x VGA, 1 x HDMI, Audio, iDoor, mSATA, 2 x mPCIe, 1 x SATA, 4 x DI, 4 x DO, 1 x Power Terminal
• Compact with Fanless Design
• Dual Power Input for avoiding Power Down Time
• Exchangeable RTC Battery with easy Access on the Top
• Digital I/O with Isolation Protection for Sensing and controlling
• Diverse system IO and Supports Fieldbus Protocol by iDoor Technology as a Protocol Gateway
• Supports MRAM by iDoor Technology
• LAN Redundancy (Teaming)

Pocket-Size DIN-Rail Edge IPC with Intel® Atom® x6413E

• Intel® Quad core x6413E processor with 4GB/8GB DDR4 onboard memory
• Compact, robust, fanless and cable-free system with high stability
• Optimized basic unit with 2 x GbE, 2 x USB, 1 x HDMI
• On-board full-size mPCIe port for various expansion capability
• Built-in TPM2.0 for hardware-based security
• System ground isolation design
• Certified with IEC 61010-2-201 for industrial application
• Ubuntu Core 20 certified hardware
• Support Windows 11 IoT Enterprise LTSC

Intel® Core Processor Series 3 with Triple LAN/Four COM/USB Type C DIN-Rail Fanless Box PC 

• Intel Core 3 304 and Core 5 320, up to 41 TOPS AI capabilities
• DDR5-6400 CSODIMM memory support up to 64GB
• Rich Industrial I/O design: 3x GbE, 4x COM, 1x USB Type C, 7x USB Type A, 1x GPIO, 2x CANbus
• Flexible expansions support: 3x M.2, idoor and POE module
• Triple displays support with HDMI+DP+USB Type C, up to 4K resolution
• 12~28V wide power input and -20~60°C wide temperature support
• TPM on board for system security
• SUSI API, WISE-DeviceOn, Trellix and Acronis bundled
• Edge AI SDK for runtime SDK integration and EdgeBMC for OOB management

Intel® Processor N200 QC SoC with Dual HDMI, Dual GbE, Dual Serial Ports, Dual CANBus, Remote Switch, USB x4

• Intel® Processor N-series N200 QC SoC
• DDR5-4800 SO-DIMM memory support up 16G
• Dual HDMI independent display support 4K resolution
• M.2 E Key and B Key for storage and wireless module installation
• TPM for system security by option
• -30 ~ 60 °C extended operating temperature
• 12V lockable DC jack power input
• Advantech DeviceOn support
• RED Certified with selected Wireless Modules

Compact DIN-Rail Edge Controller with 11th Gen Intel® Core™ i CPU

• Port isolation for 8 x DI, 8 x DO, 4 x COM
• Supports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modules
• Dual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technology
• Remote out-of-band (OOB) power management with Advantech iBMC technology
• Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified

Small-Size Integrated DIN-Rail IPC with Intel® Atom® x6425RE

• Intel® Atom®  x6425RE (1.9GHz) processor with 8GB DDR4 memory
• Wide operating temperature range (-40 ~ 70 °C) and wide power input range (10 ~ 36 VDC)
• Port isolation for 8 x DI, 8 x DO, 2 x COM
• DP++ ensures HDMI/DVI compatibility
• Dual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATA
• Onboard TPM 2.0 provides hardware-based security
• Modular design for optional iDoor extension
• Ruggedized DIN-rail kit
• Compliant with IEC 61010-1 safety requirements

Intel® 2nd Gen. Xeon® D-1700 Extreme Performance Box PC with 3 Expansion Slots

• Powered by Intel® 2nd Gen. Xeon® D-1700 series processor up to 10 cores
• 4x DDR4 SO-DIMM sockets support ECC/non-ECC memory up to 128GB
• Versatile expansion options with PCI, PCIex4, PCIex16, M.2 B Key and E key
• Support PCIex16 high performance graphic card up to 350W
• 2x 10GbE port for fast data communication (optional)
• Up to 4 x 2.5" SATAIII HDD bay
• IPMI 2.0-compliant management with reliability and security enhancements

Intel Atom x6413E QC SoC with GbE, COM, USB, HDMI/DP and DIO ports DIN-Rail Fanless Box PC

• Intel Atom® x6413E Quad Core
• DIN-Rail system with essential I/O ports on front-side bezel
• 2 x Intel GbE and 2 x RS-232/422/485
• Dual independent displays with one 4K HDMI and one 4K DP
• 2 x USB 3.2 and 2 x USB 2.0, 1 x internal USB2.0 for security dongle
• 1 x M.2 2280 B key with nano SIM holder and 1 x M.2 2230 E key, 1 x full-size mPCIe
• mSATA and 1 x 2.5" SATA storage device
• 12V ~ 28V wide range power input, -40 ~ 60 °C extended operating temperature

Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC

• i3-1115G4E CPU /Core i5-1145G7E
• DIN-Rail system with essential I/O ports on front-side bezel
• 3 x Intel GbE, 4x RS-232/422/485
• 3 x USB 3.2 and 3 x USB 2.0, dual independent displays with one 4K HDMI and one VGA
• 3 Expansion: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot
• mSATA and 1 x 2.5" SATA storage device
• 12V ~ 24V wide range power input
• -40 ~ 60 °C extended operating temperature
• WISE-DeviceOn supported for quick AI deployment at scale

12th &13th Gen Intel® Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC, PCIEx16 & 2x PCI

• Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor
• Triple independent display: HDMI + HDMI + Optional Display
• DDR5 SO-DIMM memory support up to 64 GB
• 9-36VDC wide range power input
• Up to 3sets 2.5" hard drive bays
• Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
• SUSI API, WISE-DeviceOn, McAfee and Acronis bundled

12th &13th Gen Intel® Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC, PCIEx16, PCIEx4

• Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor
• Triple independent display: HDMI + HDMI + Optional Display
• DDR5 SO-DIMM memory support up to 64 GB
• 9-36VDC wide range power input
• Up to 3sets 2.5" hard drive bays
• Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
• SUSI API, WISE-DeviceOn, McAfee and Acronis bundled

Compact Industrial Computer System with 10th Gen Intel® Core™ i CPU Socket (LGA 1200)

• Intel® 10th Gen Core™ i CPU socket-type (LGA1200) with Intel® Q470E/ H420E chipset
• 3 x independent displays (third display output (DP) via optional cable)
• 2 x GigaLan and 6 x USB3.2
• 2 x RS-232/422/485 and 2 x RS232 serial ports
• 1 x NVMe M.2 (Q470E Only), 2 x 2.5" HDD/SSD, and 1 x mSATA
• 19 ~ 24 VDC input power range
• Support Power Out 12V/5V - 2A
• Supports Advantech i-Door
• Versatile LED for system status and alarm
• PCIEx16 & 3x PCIEx4 slot

Compact Industrial Computer System with 10th Gen Intel® Core™ i CPU Socket (LGA 1200)

• Intel® 10th Gen Core™ i CPU socket-type (LGA1200) with Intel® Q470E/ H420E chipset
• 3 x independent displays (third display output (DP) via optional cable)
• 2 x GigaLan and 6 x USB3.2
• 2 x RS-232/422/485 and 2 x RS232 serial ports
• 1 x NVMe M.2 (Q470E Only), 2 x 2.5" HDD/SSD, and 1 x mSATA
• 19 ~ 24 VDC input power range
• Support Power Out 12V/5V - 2A
• Supports Advantech i-Door
• Versatile LED for system status and alarm
• PCIEx16 & PCIEx4 slot, 2x PCI

Compact Industrial Computer System with 10th Gen Intel® Core™ i CPU Socket (LGA 1200)

• Intel® 10th Gen Core™ i CPU socket-type (LGA1200) with Intel® Q470E/ H420E chipset
• 3 x independent displays (third display output (DP) via optional cable)
• 2 x GigaLan and 6 x USB3.2
• 2 x RS-232/422/485 and 2 x RS232 serial ports
• 1 x NVMe M.2 (Q470E Only), 2 x 2.5" HDD/SSD, and 1 x mSATA
• 19 ~ 24 VDC input power range
• Support Power Out 12V/5V - 2A
• Supports Advantech i-Door
• Versatile LED for system status and alarm
• PCIEx16 & PCIEx4 slot

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

• Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor
• Triple independent display: VGA + HDMI + Optional Display
• DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB
• 12-36VDC wide range power input
• Up to 4sets 2.5" hard drive bays, support Intel® SW RAID
• Support 4GbE, 8USB, 6COM, 16bit DIO
• 1x PCIEx16, 1x PCIEx4

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

• Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor
• Triple independent display: VGA + HDMI + Optional Display
• DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB
• 12-36VDC wide range power input
• Up to 4sets 2.5" hard drive bays, support Intel® SW RAID
• Support 4GbE, 8USB, 6COM, 16bit DIO
• 1x PCIEx4, 2xPCI

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

• Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor
• Triple independent display: VGA + HDMI + Optional Display
• DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB
• 12-36VDC wide range power input
• Up to 4sets 2.5" hard drive bays, support Intel® SW RAID
• Support 4GbE, 8USB, 6COM, 16bit DIO
• 1x PCIEx16, 1x PCIEx4, 2xPCI

• Fanless compact design
• Embedded with NVIDIA® Jetson™ Xavier NX up to 21 TOPS
• Supports 2 x GbE, 1 x USB 3.0 , 1 x USB 2.0
• Supports 1 x mPCIe, 1 x M.2 2280 (SATA interface)
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

Compact IoT Edge Computer with Intel® 12th Gen. Core™ i Processor

• 12th Gen Intel® Core™ i Processor up to 10 Cores
• Dual Channel DDR5-4800 up to 64GB
• M.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wireless
• Equipped with CANBus for reliable communication
• DC-in terminal block for wiring flexibility
• Supports multiple displays for ThinManager solution
• Supports software APIs, WISE DeviceOn, WISE Edge365

Edge AI Compact Box PC with Intel® Core™ Ultra Processor (Series 3)

• Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP support
• Integrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)
• Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-H
• Dual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)
• M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-Fi
• Built-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN support
• Modular I/O board design offering dual LAN or isolated DIO/CANBUS/COM

Ruggedize AI Inference System Based on NVIDIA® Jetson™ Xavier NX. This in-vehicle AI system is compact, IP67 rated, waterproof fanless design.

• Ruggedized IP67 waterproof fanless design
• Embedded with NVIDIA® Jetson Xavier™ NX up to 21 TOPS
• 2 x GbE and 4 x PoE with IEEE 802.3af compliance
• 2 x USB 3.0, 2 x CANbus, 1 x HDMI
• Linux OS with board support package (BSP)
• Supports Allxon 24/7 remote monitoring and OTA deployment

AI System Based on NVIDIA® Jetson AGX Orin™

• Compact fanless design
• Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
• Supports 4 x GbE (optional PoE), 4 x USB 3.2 Gen 2 (10 Gbit/s)
• Supports 2 x mPCIe, 2 x Nano SIM slots
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

Intel Celeron N3350 DC SoC with 4K Dual HDMI/Dual LAN/M.2 DIN-Rail Fanless Box PC

• Intel Celeron N3350 Dual Core 1.1 GHz
• DIN-Rail system with essential I/O ports on front-side bezel
• I-Grade 4G DDR3L memory and 64G SSD built-in
• Windows 10 IoT Enterprise built-in
• 60W adaptor bundled in the accessory box
• Dual HDMI display up to 4K resolution
• 1 x full-size mPCIe with SIM holder and 1 x M.2 2230 for WIFI
• 12V ~ 28V wide range power input
• -30 ~ 70 °C extended operating temperature
• Advantech WISE-PaaS/DeviceOn support

AI System Based on NVIDIA Jetson® AGX Xavier

• Fanless compact design
• Embedded with NVIDIA® Jetson™ AGX Xavier up to 32 TOPS
• Supports 2 x GbE, 2 x USB 3.0, 2 x USB 2.0, 2 x RS-232/422/485
• Supports 1 x mPCIe, 1 x M.2 2280 (PCIe x2 NVMe), PCIe Add-on Card
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

AI Inference System Based on NVIDIA® Jetson Nano™

• Fanless compact design
• Embedded with NVIDIA® Jetson™ NANO up to 472 GOPS
• Supports 2 x GbE, 1 x USB 3.0 , 1 x USB 2.0
• Supports 1 x mPCIe, 1 x M.2 2280 (SATA interface)
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices