Industrial PC

Fanless Embedded System, Intel 13th Gen i5 CPU, 2x HDMI, , 2x DisplayPort, 4x GbE LAN, 8x USB, 6x COM, PCIEx16 slot

• 13th Gen Core-i CPU, i5-13500T (35W TDP)
• 2.5" SATA SSD bay
• 2x M.2 2280 NVME SSD -slot
• Quad display support
• 150W power adapter for more power hungry applications
• 8x USB3.1
• 4x GbE LAN, RJ-45, (3x Intel I210-AT, 1x Intel i219-LM)
• 6x COM RS-232/485

DIN-rail Cybersecurity Gateway with Intel Atom® x7433RE Processor and up to 8 LAN

• Intel Atom® x7433RE processor (Amston Lake)
• DDR5-4800 SO-DIMM, up to 16GB
• Support 6 2.5GbE and 2 1GbE SFP
• Wide operating temperature from -40°C to +60°C, IP30
• Wide power input of 12 to 48V DC with dual power input
• Supports TPM 2.0
• Certified IEC 61850-3 & IEEE 1613 for power utility

Small Size DIN-rail IPC with Intel® Atom™ E3845

• Intel® Atom E3845 1.91GHz processor with 4GB DDR3L Memory
• 3 x GbE, 3 x USB, 2 x COM, 1 x VGA, 1 x HDMI, Audio, iDoor, mSATA, 2 x mPCIe, 1 x SATA, 4 x DI, 4 x DO, 1 x Power Terminal
• Compact with Fanless Design
• Dual Power Input for avoiding Power Down Time
• Exchangeable RTC Battery with easy Access on the Top
• Digital I/O with Isolation Protection for Sensing and controlling
• Diverse system IO and Supports Fieldbus Protocol by iDoor Technology as a Protocol Gateway
• Supports MRAM by iDoor Technology
• LAN Redundancy (Teaming)

Pocket-Size DIN-Rail Edge IPC with Intel® Atom® x6413E

• Intel® Quad core x6413E processor with 4GB/8GB DDR4 onboard memory
• Compact, robust, fanless and cable-free system with high stability
• Optimized basic unit with 2 x GbE, 2 x USB, 1 x HDMI
• On-board full-size mPCIe port for various expansion capability
• Built-in TPM2.0 for hardware-based security
• System ground isolation design
• Certified with IEC 61010-2-201 for industrial application
• Ubuntu Core 20 certified hardware
• Support Windows 11 IoT Enterprise LTSC

Intel® Core Processor Series 3 with Triple LAN/Four COM/USB Type C DIN-Rail Fanless Box PC 

• Intel Core 3 304 and Core 5 320, up to 41 TOPS AI capabilities
• DDR5-6400 CSODIMM memory support up to 64GB
• Rich Industrial I/O design: 3x GbE, 4x COM, 1x USB Type C, 7x USB Type A, 1x GPIO, 2x CANbus
• Flexible expansions support: 3x M.2, idoor and POE module
• Triple displays support with HDMI+DP+USB Type C, up to 4K resolution
• 12~28V wide power input and -20~60°C wide temperature support
• TPM on board for system security
• SUSI API, WISE-DeviceOn, Trellix and Acronis bundled
• Edge AI SDK for runtime SDK integration and EdgeBMC for OOB management

Intel® Processor N200 QC SoC with Dual HDMI, Dual GbE, Dual Serial Ports, Dual CANBus, Remote Switch, USB x4

• Intel® Processor N-series N200 QC SoC
• DDR5-4800 SO-DIMM memory support up 16G
• Dual HDMI independent display support 4K resolution
• M.2 E Key and B Key for storage and wireless module installation
• TPM for system security by option
• -30 ~ 60 °C extended operating temperature
• 12V lockable DC jack power input
• Advantech DeviceOn support
• RED Certified with selected Wireless Modules

Fanless Embedded System, Intel 12th Gen i5-1235U CPU, DP, HDMI, VGA, 6x GbE LAN (4xPoE), 6x USB, 2xCOM, Isolated DIO

• 12th Gen CPU, i5-1235U Ultra Low Voltage
• 2.5" SATA SSD / mSATA / NVME (Pcie4x4)
• DisplayPort, HDMI & VGA display
• 4x USB3.0 & 2x USB2.0
• 6x GbE LAN (4x PoE, 15W)
• 9-36V DC input

Digital Signage Player with Intel® Core™ i5-1335UE Processor and Intel® Processor U300E, 4 HDMI, 2 RS-232, and 2 LAN

• Intel® Core™ i5-1335UE processor and Intel® processor U300E
• 2 DDR5 SO-DIMM 5200 MHz, up to 96 GB
• 4 HDMI
• 1 1GbE LAN and 1 2.5GbE LAN
• 2 RS-232

Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and Compact Rugged Embedded Computer

• Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
• 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
• Wide Operating Temperature -40°C to 60°C
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE

Fanless Embedded System with LGA1700 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® R680E, 9 to 60 VDC for In-vehicle Intelligent Surveillance Application

• CE, FCC, E-Mark and R118 certified
• LGA1700 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor (up to 65W) with Intel® R680E
• Fanless and wide operating temperatures from -40°C to +70°C
• Up to 8/16 GbE PoE port by M12/RJ-45 connector type
• Supports M.2 Key B and M.2 Key E for wireless communication module
• Intelligent solution of vehicle power management (smart ignition)
• Convenient swappable HDD/SSD slots and flexible I/O windows

Fanless embedded system with Intel® processor N150 (Twin Lake), 2 LAN, 2 HDMI, 4 COM, 6 USB, DIO, and 9 to 36 VDC

• Intel® Processor N150 Quad-core SoC (Twin Lake)
• 8GB LPDDR5 onboard (16GB option)
• Wide operating temperature -40°C to +70°C
• Intelligent power management: ignition and USB power on/off control
• 2 2.5GbE, 6 USB, 1 DIO, and 4 COM
• 2 HDMI (FHD) for dual display
• M.2 Key E 2230, M.2 Key M 2280, and Mini PCIe
• Front-access I/O design

1U 19" Rackmount Network Appliance with 14th/13th/12th Gen Core™ i9/i7/i5/i3, Pentium® or Celeron® Processor, and up to 26 LAN

• 14th/13th/12th Gen Core™ i9/i7/i5/i3, Pentium® or Celeron® processor
• 4 DDR5-4400 MHz ECC (By CPU) or non-ECC UDIMM, up to 256GB
• 8 GbE RJ-45, 2 SFP (Intel® I350), and 2 NIC modules (optional)
• 1 PCIe x8 FH/HL (optional), 1 x M.2 Key M, 1 x M.2 Key B, and 1 x PCIe Mini Card slot

DIN-Rail Fanless Embedded System with Intel Atom® Processor x7433RE, 4 COM, 2 2.5GbE LAN, 4 USB, HDMI, DIO, and Wide Temperature

• Intel Atom® processor x7433RE
• 4 COM, 4 USB, 2 2.5GbE LAN, HDMI, and DIO
• 9 to 36 VDC wide range power input (typical: 12 to 24 VDC)
• OVP, UVP, OCP, and RPP power protection design
• Axiomtek EAPI for intelligent remote monitoring software integration

14/13/12th Generation Intel Core Series Processors, High Performance and Scalable DIN-Rail Computer

• Intel® 14/13/12th Gen Raptor Lake-S Refresh / Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 Processor
• Scalable Design with Optional Scalable Expansion Deck for I/O Modules Expansion
• Compact Size with DIN-Rail Mount Support
• Supports Dual PCIex4 NVMe SSD with RAID Function

Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and Expandable Rugged Embedded Computer

• Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
• 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
• Optional CMI Modules for I/O Expansion
• Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE
• Wide Operating Temperature -40°C to 60°C

Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and PCIe Expandable Rugged Embedded Computer, Supporting up to 2x PCI/PCIe Expansion Cards

• Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
• 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
• 2x PCI/PCIe Expansion Slots, Up to 130W Expansion
• Optional CMI Modules for I/O Expansion
• Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE
• Wide Operating Temperature -40°C to 60°C

IP67-rated Industrial System with LGA1700 Socket 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® H610E, and Front-access I/O

• M12 connectors and IP67 housing
• Optional I/O for expansion
• Intelligent power management: Ignition, and USB power on/off control
• EN 61000-6-2 certified

Intel Meteor Lake-PS Core Series (LGA Socket) Slim Embedded Computer with CDS Technology

• Intel® Meteor Lake-PS Core™ Ultra 7/5/3 Processor
• 2x DDR5 SO-DIMM Socket, Supports up to 5600MHz 64GB Memory
• 1x M.2 Key E Type 2230 Socket for Wireless / Bluetooth Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 3042 Socket for Storage/Add-on Card Expansion
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• Optional CFM Module for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 65°C
  
  

High Performance Embedded System with 12th/13th GEN Intel CPU, 6 LAN, 10 USB, 4COM, PCIEx16 & PCIEx8, 9-36V DC, FAN cooling

• Support Intel 12th/13th generation processors, LGA1700, upto 65W
• 2*SODDR4, support up to 64GB
• 1*HDMI, 1*VGA
• 6*Intel I210AT, 4 of them support POE+
• 2*RS-232 COM,  2*RS-232/485 COM
• 8*USB3.0, 3*USB2.0
• PCIEx16 slot (x8 signal) & PCIEx8 slot
• 9-36V DC Power Input
• Fan cooling (outside electronics)

High Performance Embedded System with 12th/13th GEN Intel CPU, 6 LAN, 10 USB, 4COM, 9-36V DC, FAN cooling

• Support Intel 12th/13th generation processors, LGA1700, upto 65W
• 2xSODDR4, support up to 64GB
• 1*HDMI, 1*VGA
• 6*Intel I210AT, 4 of them support POE+
• 2*RS-232 COM,  2*RS-232/485 COM
• 8*USB3.0, 3*USB2.0
• 9-36V DC Power Input
• Fan cooling (outside electronics)

Fanless Embedded AI System with Intel® Core™ Ultra Processor, HDMI/DisplayPort, 4 LAN, 4 COM, 6 USB, 2 USB Type-C, and 9 to 60 VDC

• Intel® Core™ Ultra processor (Meteor Lake-U/H)
• Multiple compute engines: CPU, GPU (Intel® Arc GPU by H SKU) and NPU (Intel® AI Boost)
• Dual channel DDR5 5600 SO-DIMM, up to 64GB
• 6 USB and 2 USB Type-C with DisplayPort support
• Supports multiple display interfaces with 1 HDMI 1.4b and 3 x DisplayPort (2 ports via USB Type-C)
• Three 2.5GbE LAN with TSN and 1 GbE
• Two 2.5" front-access swappable HDD/SSD and 1 M.2 Key M 2280
• Wide operating temperature range from -40°C to +70°C
• Wide power input range from 9 to 60 VDC
• Supports the OpenVINO™ toolkit for AI computing

Intel® Alder Lake-N Processor Entry Performance and Compact Rugged Embedded Computer

• Onboard Intel® Alder Lake-N Processor N97 and Core™ i3-N305 Processor
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 16GB Memory
• 1x M.2 Key B Type 3052/3042 Socket for 5G Module Expansion
• 1x M.2 key B Type 2242 Socket for I/O Module Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function

14/13/12th Gen Intel® Core™ Modular GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• 4x 2.5GbE LAN and optional 2x 10GbE LAN
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2280 Socket for Add-on Card Expansion
• 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm) , 1x M.2 key M for NVMe SSD
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Versatile Mounting Methods (Tower Stand / Desktop / 19”Rack / Vehicle Mount)
• Wide Operating Temperature -40°C to 70°C

14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
• 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
• 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Ultra-Compact DIN-Rail Fanless Embedded System with Intel® Celeron® Processor N3350, COM, 2 LAN, 4 USB, HDMI, WT

• Super compact size with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• COM, 4 USB, and 2 GbE LAN
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC wide range power input (typical: 12 to 24 VDC)
• OVP, UVP, OCP, and RPP power protection design
• AXEAPI for intelligent remote monitoring software integration

Fanless Embedded System with Intel® Alder Lake-N Processor, 2 LAN/4 LAN, HDMI, DisplayPort++, 2 COM, 4 USB, and 9 to 36 VDC

• Intel® processor N97 quad-core SoC (Alder Lake-N)
• 1 DDR4 SO-DIMM, up to 32GB
• Operating temperature ranges from -20°C to +60°C
• Supports either two or four 2.5GbE versions
• 4 USB with a power on/off feature and 2 COM
• Supports HDMI (FHD) and DisplayPort++ for dual-view
• Front-access I/O design

CMI Module with 1x LPT Port, 1x PS/2 Port

• CMI (Combined Multiple I/O) Technology
• Rugged Design Features: Cableless
• 1x 6-pin Mini-DIN Connector
• 1x DB25 Connector

Intel Alder Lake-N Processor Rugged Embedded Computer

• Onboard Intel ® Alder Lake-N Processor N97
• Onboard Intel Alder Lake-N Atom® x7425E
• Ultra Compact Size (150 x 105 x 52.3 mm)
• 1 x DDR5 SO-DIMM Sockets, Supports Up to 4800MHZ, 16GB
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI modules for I/O expansion
• Wide Operating Temperature -40°C to 70°C

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

• Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Fanless Embedded System with 13th Gen Intel® Core™ i7/i5/Celeron® Processor, 2 HDMI, 2 LANs, 8 USB, 2 COM, and 12 VDC

• 13th gen Intel® Core™ processor (Raptor Lake P)
• Fanless design with operating temperature from -20°C to 60°C
• 1 DDR4 SO-DIMM for up to 32GB of memory
• Intelligent power ignition management and USB power on/off control
• Supports high-speed NVMe storage (M.2 Key M 2280)
• Excellent heat-dissipation DIN-rail system
• Supports Intel® vPro and TPM 2.0

Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

• Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
• Quad Independent Display (2x DP/HDMI/CMI Display)
• 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function & PoE
• Wide Operating Temperature -40°C to 70°C

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

DIN-Rail Cybersecurity Gateway with Intel Atom® x5-E3930/E3940 Processor and 4 LAN with LAN Bypass

• Cost-effective with fanless design
• Intel Atom® x5-E3930/E3940 processor (Apollo Lake)
• 4 GbE RJ-45 (Intel® I210-IT) with LAN Bypass
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
• Supports TPM 2.0
• Ideal for ICS cybersecurity and critical infrastructure protection

Fanless Edge AI System with NVIDIA® Jetson Orin™ NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, Isolated DIO (4-in/4-out), and 4-CH GMSL for AMR & Robotics

• NVIDIA® Jetson Orin™ NX (100 TOPS)
• Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
• Easily manage: USB and PoE device power control
• Supports dual PoE for camera & sensor connectivity
• -25°C to +60°C operating temperature range
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
• Supports NVIDIA Isaac™ Robot Operating System (ROS) SDK for AI-enabled robots development 

Edge AI Developer Kit with NVIDIA® Jetson Orin™ NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Edge AI Developer Kit with NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Compact DIN-Rail Edge Controller with 11th Gen Intel® Core™ i CPU

• Port isolation for 8 x DI, 8 x DO, 4 x COM
• Supports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modules
• Dual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technology
• Remote out-of-band (OOB) power management with Advantech iBMC technology
• Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified

Small-Size Integrated DIN-Rail IPC with Intel® Atom® x6425RE

• Intel® Atom®  x6425RE (1.9GHz) processor with 8GB DDR4 memory
• Wide operating temperature range (-40 ~ 70 °C) and wide power input range (10 ~ 36 VDC)
• Port isolation for 8 x DI, 8 x DO, 2 x COM
• DP++ ensures HDMI/DVI compatibility
• Dual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATA
• Onboard TPM 2.0 provides hardware-based security
• Modular design for optional iDoor extension
• Ruggedized DIN-rail kit
• Compliant with IEC 61010-1 safety requirements

Intel® 2nd Gen. Xeon® D-1700 Extreme Performance Box PC with 3 Expansion Slots

• Powered by Intel® 2nd Gen. Xeon® D-1700 series processor up to 10 cores
• 4x DDR4 SO-DIMM sockets support ECC/non-ECC memory up to 128GB
• Versatile expansion options with PCI, PCIex4, PCIex16, M.2 B Key and E key
• Support PCIex16 high performance graphic card up to 350W
• 2x 10GbE port for fast data communication (optional)
• Up to 4 x 2.5" SATAIII HDD bay
• IPMI 2.0-compliant management with reliability and security enhancements