Rugged Performance

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

• Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

9/8th Gen. Intel® Core™ Series High Performance and Essential Rugged Embedded Computer

• Supports 9/8th Gen Intel® Core™ i7/i5/i3 or Pentium®/Celeron® processors (up to 65W)
• Compact size (224 x 162 x 64 mm)
• 1 x M.2 2280 key M socket, auto-detection for NVMe/SATA SSD
• 1 x M.2 2230 key E for Intel® CNVi/wireless module
• 2 x Full-size Mini PCIe sockets for module expansion
• Optional CMI/MEC modules for I/O expansion
• Wide operating temperature: -40°C to 70°C
• Military standard (MIL-STD-810G) shock & vibration proof
• Railway EMC standard EN50155 (EN 50121-3-2 only) certified

12th/13th Generation Intel Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 2x PCI/PCIe Expansion Slot

12th/13th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 1x PCI/PCIe Expansion Slot

12th/13th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer

12th Gen. Intel® Core™ Series High Performance and Compact Rugged Embedded Computer

• Intel® 12th Gen Alder Lake-S Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• Quad Independent Display (HDMI / DP / DVI-I)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• Safety Standard: CE, e-Mark, EN 62368-1

9/8th Generation Intel® Xeon® and Core™ Processors, Extreme Performance, Compact and Modular Rugged Workstation

• Supports 9/8th Gen Intel® Xeon® and Core™ Octa/Hexa-core Processor
• Triple Independent Display with 4K/2K UHD Resolution (HDMI / DP / DVI-I)
• 2x 2.5" Hot Swap SATA HDD/SSD Tray, 3x mSATA Socket
• 2x USB 3.1 (10Gb/s) for Ultimate Data-transfer Speed
• 1x M.2 E Key Socket (CNVi), 3x Full-size Mini-PCIe Socket, 1x SIM Card Socket
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Sensing (with optional CFM modules)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13 No.10R-0515210), LVD EN62368-1, EN50121-3-2

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 2x PCI/PCIe Slots for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 9/8th Gen Intel® Core™  35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 1x PCI/PCIe Slot for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 7/6th-Gen Intel® Core™ i3 / i5 / i7 Socket-type CPU (LGA1151)
• 2x DDR4 SO-DIMM Socket, 2,133MHz, Supports Up to 64 GB
• Triple Independent Display (1x DVI-I, 2x DP)
• 2x 2.5" SATA HDD/SSD bay (Gen3), Supports RAID 0/1
• 2x CMI Interfaces with 6 Types of Optional Modules for I/O Expansion
• 1x CFM Interface for Adding Optional Power Ignition Sensing (IGN) Module
• Supports 3x Full-size Mini-PCIe Slot for Wireless & I/O Expansion
• Wide Operating Temperature (-40°C to 70°C)
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13, No.10R-0514229) Certified

• Supports 7/6th Generation Intel® Xeon® / Core™ LGA1151 Socket Type Processors
• Intel® C236 Chipset
• 2x DDR4-2133/2400 SO-DIMM Sockets, up to 64GB Memory
• Triple Independent Display (1x DVI-I, 2x DisplayPort)
• 2x 2.5" Hot Swap SATA III HDD/SSD bays, Supports RAID 0/1
• 3x CMI Interfaces for RJ45/M12 GbE LAN, COM & DIO Expansions
• 2x CFM Interfaces for Power Ignition Sensing and PoE Functions
• 4x Full-size Mini-PCIe Slots for Wireless & I/O Expansions
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13) Certification for In-vehicle Application