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eBOX671B-ALD-GbE
SKU
eBOX671B-ALD-GbE
Lead time 21-30 days
Fanless embedded system with LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor, Intel® R680E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 36 VDC
- 13th/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
| System | |
| Processor | LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 & Celeron® processor (35W/65W) |
| CPU Performance | |
| Security Hardware | TPM 2.0 |
| Chipset | Intel® R680E |
| Storage | 2 x 2.5” SATA HDD/SSD (up to 9.5 mm height) 2 x mSATA (enabled in jumper setting) |
| Storage Support | |
| Memory | 2 x 262-pin DDR5-4800 SO-DIMM, up to 64GB |
| Graphics | Integrated Intel® HD Graphics |
| I/O Ports | |
| USB 2.0 | - |
| USB 3.0 | 2 x USB 3.2 Gen1 4 x USB 3.2 Gen2 |
| Serial | 2 x RS-232 2 x RS-232/422/485 |
| Video | 2 x HDMI 1.4b (lockable) 1 x DisplayPort 1.4 ++ |
| Ethernet | 3 x 2.5 GbE (Intel® i226-IT) 1 x GbE LAN (Intel® i219-LM) |
| Other Ports | 1 x Audio 1 x Power button 1 x Remote switch 1 x Front access SIM slot with cover (for M.2 Key B) 1 x Reset switch connector 5 x Antenna opening |
| Expansion | |
| Expansion Interface | 1 x Full-size PCI Express Mini Card slot (USB 2.0 +
PCIe + SIM + mSATA signal) 1 x M.2 Key M 2280 socket (for storage) 1 x M.2 Key E 2230 socket (for Wi-Fi 6E) 1 x M.2 Key B 3052 socket (for 5G) 1 x Internal SIM slot for PCIe Mini Card slot 1 x MXM3.1 type A connector 1 x Flexible IO window (Default: 2 x DB9 half-cut bracket) |
| Operating System | |
| Operating System | Win 10 IoT, Win 11 IoT, Linux |
| Power | |
| DC Input / Source Voltage | 9 to 36 VDC with ACC ignition |
| Operating Temperature | |
| Operating Temperature | Without MXM module: -40°C to +65°C (with W.T. DRAM & SSD, CPU TDP 35W) -40°C to +55°C (with W.T. DRAM & SSD, CPU TDP 65W) With MXM module: -40°C to +55°C (with W.T. DRAM & SSD & MXM kit, CPU TDP 35W) |
| Humidity Range | 10% ~ 90%, non-condensing |
| Cooling System / Thermal Solution | |
| Thermal Solution | Passive – Fanless (Fan available) |
| Dimensions / Weight | |
| Weight (kg) | 4.9 kg |
| Dimensions | 280 x 210 x 80.5 mm |
| Enclosure | |
| Bezel | |
| Material | Aluminum / Steel |
| Mounting | Desk / Wall mounting kit / DIN-rail kit |
| Peripherals & Devices | |
| Accessories | Optional Modules |
| Extra Features | |
| Certification | |
| Certification | CE, FCC Class A |
| Cooling | Fanless |
|---|---|
| CPU Family | Alder Lake (12th Gen Core i3/i5i7/i9) |