Toggle Nav

MIC-733-AO

SKU
MIC-733-AO
Lead time 21-30 days

AI System Based on NVIDIA® Jetson AGX Orin™

  • Compact fanless design
  • Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
  • Supports 4 x GbE (optional PoE), 4 x USB 3.2 Gen 2 (10 Gbit/s)
  • Supports 2 x mPCIe, 2 x Nano SIM slots
  • Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices
Customize MIC-733-AO

* Required Fields

Your Customization
MIC-733-AO
MIC-733-AO

EUR0.00

Summary
    System
    Processor AGX Orin 32G:
    8-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 2MB L2 + 4MB L3

    AGX Orin 64G
    12-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 3MB L2 + 6MB L3
    GPU AGX Orin 32G:
    1792-core NVIDIA Ampere GPU with 56 Tensor
    Cores, Maximum Operating Frequency: 930 MHz

    AGX Orin 64G:
    2048-core NVIDIA Ampere GPU with 64 Tensor
    Cores] Maximum Operating Frequency: 1.3GH
    Chipset SoC
    Storage 1 x Micro SD slot
    1 x M.2 Key B 2280 with PCIe x4 NVMe SSD slot
    Memory 32GB 256-bit LPDDR5 DRAM
    64GB 256-bit LPDDR5 DRAM
    AI Accelerator NVIDIA® Jetson AGX Orin™
    I/O Ports
    USB 2.0 2 x USB2.0
    USB 3.0 4 x USB3.2
    Serial 2 x RS-232/422/485 (On-board pin header)
    Video 1 x HDMI
    Ethernet 4 x 10/100/1000 Mbps
    Other Ports DIO 4/4ch
    Expansion
    Expansion Interface 2 x Full-size PCI Express Mini Card slot (USB + PCI Express signal)
    2 x Nano SIM slot
    1 x M.2 3052 (B-Key, signal: PCIe + USB)
    Operating System
    Operating System Linux Ubuntu 18.04 or later
    Power
    DC Input / Source Voltage Power Input Voltage 9-36V DC
    Operating Temperature
    Operating Temperature 0°C to 60°C
    Humidity Range 10% ~ 95%, non-condensing
    Cooling System / Thermal Solution
    Thermal Solution Fanless
    Dimensions / Weight
    Construction Aluminum die-casting and heavy-duty steel,
    Weight (kg) 4.5kg
    Dimensions 192 x 230 x 87mm
    Certification
    Certification UL/CB/CE/FCC/BSMI/CCC
    More Information
    CoolingFanless