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DV-1100

SKU
DV-1100
In Stock

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

  • Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
  • 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
  • 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
  • 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
  • 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
  • Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
  • Wide operating temperature -40°C to 70°C
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DV-1100
DV-1100

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Summary
  • Barebone:
    1 x DV-1100
  • CPU:
    1 x 4.5Ghz Intel Core™ i5-13500TE, 14-Cores, 35W
  • Memory:
    1 x 8GB DDR5 SO-DIMM, Wide-Temp
  • HDD:
    1 x 256GB SATA3 SSD, TLC Ind, T376, Wide-Temp, Power-Guard

System
Processor 13th Generation Intel® Raptor Lake-S Series CPU
12th Generation Intel® Alder Lake-S Series CPU
   
Security Hardware  
Chipset Intel H610E Chipset
Storage 1x 2.5” SATA HDD/SSD Bay
1x M.2 SSD Shared by M.2 Key M Type 2280 Socket,
Support PCIe Gen 4x4 NVMe SSD or SATA 3.0 SSD
2x M.2 SSD Shared by M.2 Key B Socket,
Support PCIe Gen 3x2 NVMe SSD or SATA 3.0 SSD
Audio Realtek® ALC888, High Definition Audio
Memory 1x DDR5 4800MHz SO-DIMM Socket
Supports Un-buffered and non-ECC Type, Up to 32GB
Graphics Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
Integrated Intel® UHD Graphics 730: Core™ i3
Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
I/O Ports
USB 2.0 3x USB2.0
USB 3.0
1x 10Gbps USB3.2 Gen 2x1, Type A
2x 5Gbps USB3.2 Gen 1x1, Type A

Serial 2x RS-232/422/485
Video 1 x VGA
1 x DisplayPort
1x CMI Interface for Optional CMI-DP/CMI-HDMI Module Expansion
Ethernet 1x 2.5GbE LAN, RJ45, Intel® I225
1x 1GbE LAN, RJ45, Intel® I219
Other Ports Mic-in/Line-out
1x Remote Power On/Off Connector
Expansion
Expansion Interface 1x CFM IGN Interface for optional CFM-IGN Module Expansion
1x CMI Interface for optional CMI-Display Module Expansion
2x CMI Interface for optional CMI-COM/DIO Module Expansion

1x M.2 Key B Type 3042/3052 Socket,
Support 5G/Storage/Add-on Card Expansion
1x M.2 Key B Type 2242 Socket,
Support Storage/Add-on Card Expansion
1x M.2 Key E Type 2230 Socket,
Support Wireless/Intel CNVi Module Expansion
1x SIM Socket
Operating System
Operating System Windows® 10 / Windows® 11/ Linux
Power
DC Input / Source Voltage Power Input Voltage 9~48VDC
IGN function with optional module
Operating Temperature
Operating Temperature 35W TDP Processor: -40°C to 70°C
65W TDP Processor: -40°C to 55°C (with external fan)
Humidity Range 10% ~ 95%, non-condensing
Cooling System / Thermal Solution
Thermal Solution Passive - Fanless
Dimensions / Weight
Weight (kg) 2.5 kg
Dimensions 224 x 162 x 62 mm
Enclosure
Bezel  
Material Aluminum / Steel
Mounting Wall / DIN-RAIL / VESA Mount
Peripherals & Devices
Accessories Optional Modules
Extra Features  
Certification
Certification CE, UKCA, FCC, ICES-003 Class A
EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only)
EN 50155 (EN 50121-3-2 Only)
E-mark




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