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DI-1100

Tuotenro
DI-1100
Varastossa

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU

  • Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
  • 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
  • 2x full-size Mini PCIe sockets for module expansion
  • 2x front-accessible SIM card slots for signal redundancy
  • Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
  • Optional CFM modules (power ignition sensing, or 4x PoE)
  • Wide operating temperature -40°C to 70°C
  • MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified
Muokkaa DI-1100
DI-1100

* Pakolliset kentät

Tuote
DI-1100
DI-1100

0,00 EUR

Yhteenveto
    System
    Processor Onboard 8th Intel® Core™ U Processors (Whiskey Lake)
    • Intel® Core™ i7-8665UE Quad Core Processor (8M Cache, up to 4.4 GHz, 15W)
    • Intel® Core™ i5-8365UE Quad Core Processor (6M Cache, up to 4.10 GHz, 15W)
    • Intel® Core™ i3-8145UE Dual Core Processor (4M Cache, up to 3.90 GHz, 15W)
    Security Hardware
    Chipset SoC
    Storage 1x 2.5” SATA HDD/SSD Bay
    1x mSATA Socket (shared by Mini-PCIe socket)
    Support RAID 0/1
    Memory 1x DDR4 SO-DIMM Socket, Support Up to 2400MHz 32 GB
    Graphics Integrated Intel® UHD Graphics 620
    I/O Ports
    USB 2.0 2 x USB2.0
    USB 3.2 2x USB 3.2 (10Gbps)
    2x USB 3.2 (5Gbps)
    Serial 2x RS-232/422/485
    Video 1 x DisplayPort
    1 x HDMI
    1 x VGA
    Ethernet 2x GbE LAN , RJ-45
    Other Ports Mic-in/Line-out
    1x PS2 keyboard/mouse
    1x Remote Power On/Off Connector
    Expansion
    Expansion Interface 1x High Speed CMI Interface for optional CMI Module Expansion
    1x Low Speed CMI Interface for optional CMI Module Expansion
    2x Full-size Mini-PCIe Sockets
    2x SIM Socket
    Operating System
    Operating System Windows® 10, Linux
    Power
    DC Input / Source Voltage Power Input Voltage 9~48VDC
    Operating Temperature
    Operating Temperature -40°C ~ +70°C with W.T. SSD, 15W TDP CPU
    Humidity Range 10% ~ 95%, non-condensing
    Cooling System / Thermal Solution
    Thermal Solution Passive - Fanless
    Dimensions / Weight
    Weight (kg) 1.7 kg
    Dimensions 203 x 142 x 66.8 mm
    Enclosure
    Bezel
    Material Aluminum / Steel
    Mounting Desk / Wall mounting/ DIN-Rail / VESA
    Peripherals & Devices
    Accessories Optional Modules
    Extra Features
    Certification
    Certification CE, FCC, ICES-003 Class A, EN50121-3-2 (Railway), E-mark
    Lisätietoja
    Jäähdytys Fanless