Rugged Performance
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DV-1000
9/8th Gen. Intel® Core™ Series High Performance and Essential Rugged Embedded Computer
- Supports 9/8th Gen Intel® Core™ i7/i5/i3 or Pentium®/Celeron® processors (up to 65W)
- Compact size (224 x 162 x 64 mm)
- 1 x M.2 2280 key M socket, auto-detection for NVMe/SATA SSD
- 1 x M.2 2230 key E for Intel® CNVi/wireless module
- 2 x Full-size Mini PCIe sockets for module expansion
- Optional CMI/MEC modules for I/O expansion
- Wide operating temperature: -40°C to 70°C
- Military standard (MIL-STD-810G) shock & vibration proof
- Railway EMC standard EN50155 (EN 50121-3-2 only) certified
Tulossa -
DI-1100
Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU
- Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
- 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
- 2x full-size Mini PCIe sockets for module expansion
- 2x front-accessible SIM card slots for signal redundancy
- Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
- Optional CFM modules (power ignition sensing, or 4x PoE)
- Wide operating temperature -40°C to 70°C
- MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified
Varastossa -
DX-1000
- Supports 7/6th Generation Intel® Xeon® / Core™ LGA1151 Socket Type Processors
- Intel® C236 Chipset
- 2x DDR4-2133/2400 SO-DIMM Sockets, up to 64GB Memory
- Triple Independent Display (1x DVI-I, 2x DisplayPort)
- 2x 2.5" Hot Swap SATA III HDD/SSD bays, Supports RAID 0/1
- 3x CMI Interfaces for RJ45/M12 GbE LAN, COM & DIO Expansions
- 2x CFM Interfaces for Power Ignition Sensing and PoE Functions
- 4x Full-size Mini-PCIe Slots for Wireless & I/O Expansions
- EN50121-3-2 Certified for Railway Application
- E-Mark (E13) Certification for In-vehicle Application
Toimitusaika 21-30pv -
GP-3000
9th/8th Gen Intel® Xeon®/Core™ GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W
- Supports 9th/8th Gen Intel® Xeon®/Core™ Processor (35W / 65W / 80W)
- 2 x DDR4 SO-DIMM Sockets, Supports ECC/non ECC type up to 2666 MHz, 64GB
- 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm)
- 1 x M.2 M Key Socket (NVMe), 1 x M.2 E Key Socket (CNVi)
- 2 x Front Accessible SIM Card Slots for Signal Redundancy
- CMI Technology for Various I/O Module Expansions
- CFM Technology for Power Ignition Sensing & PoE Function
- Versatile Mounting Methods (Wall / Stand / Face-up / 19" Rack Mount)
- Military Standard Shock & Vibration Proof
Toimitusaika 21-30pv -
DI-1000-i3
- Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
- 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
- Triple Independent Display (DVI-I, DisplayPort)
- Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
- 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
- Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
- Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
- Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
- Cincoze MEC Module Kits for Various I/O Expansion
- 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
- Wide Operating Temperature (-40°C to 70°C)
- EN50121-3-2 Certified for Railway Application
- E-Mark (E13, No. 10R-0514273) Certified for In-vehicle Application
Toimitusaika 21-30pv -
DS-1301
- 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
- 2x GbE LAN and optional 2x 10GbE LAN
- 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
- 2x PCI/PCIe expansion slots
- 3x full-size Mini PCIe sockets, 2x SIM card slots
- Optional CMI modules for I/O expansion
- Optional CFM modules for ignition sensing & PoE
- Wide operating temperature -40°C to 70°C
- MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)
Toimitusaika 21-30pv -
DS-1302
- 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
- 2x GbE LAN and optional 2x 10GbE LAN
- 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
- 2x PCI/PCIe expansion slots
- 3x full-size Mini PCIe sockets, 2x SIM card slots
- Optional CMI modules for I/O expansion
- Optional CFM modules for ignition sensing & PoE
- Wide operating temperature -40°C to 70°C
- MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)
Toimitusaika 21-30pv -
DS-1300
- 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
- 2x GbE LAN and optional 2x 10GbE LAN
- 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
- 3x full-size Mini PCIe sockets, 2x SIM card slots
- Optional CMI modules for I/O expansion
- Optional CFM modules for ignition sensing & PoE
- Wide operating temperature -40°C to 70°C
- MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)
Toimitusaika 21-30pv -
DS-1202
- Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
- 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
- Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
- 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
- 2x Front Accessible SIM Card Slots for Signal Redundancy
- 2x PCI/PCIe Slots for Add-on Cards (Maximum Length: 235 mm)
- 4x CMI Slots for Modular I/O Expansions
- 1x CFM Slot for Power Ignition Sensing Function
- Wide Operating Temperature (-40°C to 70°C )
- EN50121-3-2 Certified/ LVD EN62368-1
Varastossa -
DS-1201
- Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
- 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
- Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
- 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
- 2x Front Accessible SIM Card Slots for Signal Redundancy
- 1x PCI/PCIe Slot for Add-on Cards (Maximum Length: 235 mm)
- 4x CMI Slots for Modular I/O Expansions
- 1x CFM Slot for Power Ignition Sensing Function
- Wide Operating Temperature (-40°C to 70°C )
- EN50121-3-2 Certified/ LVD EN62368-1
Toimitusaika 21-30pv -
GM-1000
- Supports 9th/8th Gen Intel® Xeon®/Core™ Processor up to 8 cores
- Supports 1x MXM 3.1 Type A/B form factor GPU module expansion
- 2x DDR4 SO-DIMM sockets, up to 2666MHz, 64GB
- Supports wide operating temperature (-40°C - 70°C) and vibration/shock tolerance (5G/50G)
- 260 mm x 200 mm x 85 mm compact footprint
- Flexible functionality expansions:
- M.2 E key (CNVi), full-size Mini-PCIe and M.2 M Key (NVMe SSD)
- Proprietary CMI interface for various I/O expandability
- Proprietary CFM interface for PoE+ or Power Ignition Sensing
Toimitusaika 21-30pv -
DX-1100
9/8th Generation Intel® Xeon® and Core™ Processors, Extreme Performance, Compact and Modular Rugged Workstation
- Supports 9/8th Gen Intel® Xeon® and Core™ Octa/Hexa-core Processor
- Triple Independent Display with 4K/2K UHD Resolution (HDMI / DP / DVI-I)
- 2x 2.5" Hot Swap SATA HDD/SSD Tray, 3x mSATA Socket
- 2x USB 3.1 (10Gb/s) for Ultimate Data-transfer Speed
- 1x M.2 E Key Socket (CNVi), 3x Full-size Mini-PCIe Socket, 1x SIM Card Socket
- Supports CMI Interface for I/O Expandability
- Supports PoE+ and Power Ignition Sensing (with optional CFM modules)
- Wide Operating Temperature -40°C to 70°C
- E-Mark (E13 No.10R-0515210), LVD EN62368-1, EN50121-3-2
Varastossa -
DS-1200
- Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
- 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
- Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
- 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
- 2x Front Accessible SIM Card Slots for Signal Redundancy
- 4x CMI Slots for Modular I/O Expansions
- 1x CFM Slot for Power Ignition Sensing Function
- Wide Operating Temperature (-40°C to 70°C )
- EN50121-3-2 Certified/ LVD EN62368-1
Toimitusaika 21-30pv -
DS-1100
- Supports 7/6th-Gen Intel® Core™ i3 / i5 / i7 Socket-type CPU (LGA1151)
- 2x DDR4 SO-DIMM Socket, 2,133MHz, Supports Up to 64 GB
- Triple Independent Display (1x DVI-I, 2x DP)
- 2x 2.5" SATA HDD/SSD bay (Gen3), Supports RAID 0/1
- 2x CMI Interfaces with 6 Types of Optional Modules for I/O Expansion
- 1x CFM Interface for Adding Optional Power Ignition Sensing (IGN) Module
- Supports 3x Full-size Mini-PCIe Slot for Wireless & I/O Expansion
- Wide Operating Temperature (-40°C to 70°C)
- EN50121-3-2 Certified for Railway Application
- E-Mark (E13, No.10R-0514229) Certified
Toimitusaika 21-30pv -
P2102E CDS PC Module, i5
- Onboard 8th Generation Intel® Core™ U Series Processor
- 2x DDR4 SO-DIMM Socket, Supports Up to 2400MHz, 64GB
- Supports Triple Independent Display
- Integrated USB 3.2 Gen 2 supports up to 10Gbps
- M.2 E Key Socket for Wireless Module or Intel CRF Module
- Supports Ignition Sensing Function (IGN) (with optional CFM module)
- Supports 2x PoE+ Function (with optional CFM module)
- 1x PCI or 1x PCIe Slot for Add-on Card Expansion: Max. Length 180mm (with optional riser card)
- Supports CDS Technology for Convertible Panel PC
- Built-in Two 2W Internal Speakers
Toimitusaika 21-30pv -
P2102 CDS PC Module, i5
• Onboard 8th Generation Intel® Core™ U Series Processor
• 2x DDR4 SO-DIMM Socket, Supports Up to 2400MHz, 64GB
• Supports Triple Independent Display
• Integrated USB 3.2 Gen 2 supports up to 10Gbps
• M.2 E Key Socket for Wireless Module or Intel CRF Module
• Supports Ignition Sensing Function (IGN) (with optional CFM module)
• Supports 2x PoE+ Function (with optional CFM module)
• Supports CDS Technology for Convertible Panel PC
• Built-in Two 2W Internal SpeakersToimitusaika 21-30pv -
P2002E CDS PC Module, i56th Generation Intel® Core U Series (Skylake) Fanless Computer with CFM and CDS Interface, PCI/PCIE slotToimitusaika 21-30pv
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P2002 CDS PC Module, i56th Generation Intel® Core U Series (Skylake) Fanless Computer with CFM and CDS InterfaceToimitusaika 21-30pv
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DS-1102Vehicle Computer, 6th Generation Intel Core i3 / i5 / i7, Modular and Expandable, Rugged, 2x PCI/PCIe slotToimitusaika 21-30pv
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DS-1101Vehicle Computer, 6th Generation Intel Core i3 / i5 / i7, Modular and Expandable, Rugged, 1x PCI/PCIe slotToimitusaika 21-30pv