Axiomtek

Ultra-Compact DIN-Rail Fanless Embedded System with Intel® Celeron® Processor N3350, COM, 2 LAN, 4 USB, HDMI, WT

• Super compact size with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• COM, 4 USB, and 2 GbE LAN
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC wide range power input (typical: 12 to 24 VDC)
• OVP, UVP, OCP, and RPP power protection design
• AXEAPI for intelligent remote monitoring software integration

Fanless Embedded System with Intel® Alder Lake-N Processor, 2 LAN/4 LAN, HDMI, DisplayPort++, 2 COM, 4 USB, and 9 to 36 VDC

• Intel® processor N97 quad-core SoC (Alder Lake-N)
• 1 DDR4 SO-DIMM, up to 32GB
• Operating temperature ranges from -20°C to +60°C
• Supports either two or four 2.5GbE versions
• 4 USB with a power on/off feature and 2 COM
• Supports HDMI (FHD) and DisplayPort++ for dual-view
• Front-access I/O design

Fanless Embedded System with 13th Gen Intel® Core™ i7/i5/Celeron® Processor, 2 HDMI, 2 LANs, 8 USB, 2 COM, and 12 VDC

• 13th gen Intel® Core™ processor (Raptor Lake P)
• Fanless design with operating temperature from -20°C to 60°C
• 1 DDR4 SO-DIMM for up to 32GB of memory
• Intelligent power ignition management and USB power on/off control
• Supports high-speed NVMe storage (M.2 Key M 2280)
• Excellent heat-dissipation DIN-rail system
• Supports Intel® vPro and TPM 2.0

DIN-Rail Cybersecurity Gateway with Intel Atom® x5-E3930/E3940 Processor and 4 LAN with LAN Bypass

• Cost-effective with fanless design
• Intel Atom® x5-E3930/E3940 processor (Apollo Lake)
• 4 GbE RJ-45 (Intel® I210-IT) with LAN Bypass
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
• Supports TPM 2.0
• Ideal for ICS cybersecurity and critical infrastructure protection

Fanless Edge AI System with NVIDIA® Jetson Orin™ NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, Isolated DIO (4-in/4-out), and 4-CH GMSL for AMR & Robotics

• NVIDIA® Jetson Orin™ NX (100 TOPS)
• Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
• Easily manage: USB and PoE device power control
• Supports dual PoE for camera & sensor connectivity
• -25°C to +60°C operating temperature range
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
• Supports NVIDIA Isaac™ Robot Operating System (ROS) SDK for AI-enabled robots development 

Edge AI Developer Kit with NVIDIA® Jetson Orin™ NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Edge AI Developer Kit with NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

• Fanless embedded system
• Intelligent power management Ignition, USB power on/off control
• EN 61000-6-2 certified
• Optional DIN-rail, bookshelf and wall mount kits
• Optional PCIEx16 -slot

Fanless Embedded System with LGA1700 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor, Intel® H610, 4 COM, 2 LANs, 2 HDMI, 4 USB, 8-CH DIO and 19VDC

• LGA1700 12th gen Intel® Core™ i7/i5/i3, 35W TDP
• Intel® UHD Graphics 770 by Intel® Xe Architecture with up to 32 graphics
• 8-CH DIO
• 2 HDMI for dual display outputs
• -10˚C to +50˚C wide operating temperatures
• 19VDC power input w/power protection
• Cost-effective design

Fanless Embedded System with 12th Gen Intel® Core™ i7/i5/i3 Processor for Railway

• CE, LVD, FCC, EN 50155, EN 45545-2 certified
• 12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-U)
• 24 to 110 VDC for Railway applications
• Value-added modules available for various I/O requirements (COM/LAN/DIO/PoE/CAN/BNC)
• Intelligent solution of power management (ACC ignition)
• 2 swappable 2.5" SATA drives

Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q670E, and Front-access I/O

• 4 PCIe slot
• Optional extension system I/O window
• Optional 5G network (Q670E)
• USB power on/off control via BIOS setting
• Intelligent power management - ACC ignition
• EN 61000-6-2 certified
• Supports Intel® RST

Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 Processor, Intel® H610E/Q670E, and Front-access I/O

• 2 PCIe slot / PCIe & PCI slot
• Optional extension system I/O window
• Optional 5G network (Q670E)
• USB power on/off control via BIOS setting
• Intelligent power management - ACC ignition
• EN 61000-6-2 certified
• Supports Intel® RST

Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, Intel® Q670E, and Front-access I/O

• Fanless embedded system
• Optional extension system I/O window
• Optional 5G network (Q670E)
• USB power on/off control via BIOS setting
• Intelligent power management - ACC ignition
• EN 61000-6-2 certified
• Supports Intel® RST

Fanless embedded system with LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor, Intel® R680E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 36 VDC 

• 13th/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (Alder Lake S)
• Dual DDR5 SO-DIMM for up to 64GB of memory
• 4 LAN with optional PoE supported
• Dual 2.5" SATA HDD drive bays with RAID 0 & 1
• Supports MXM 3.1 Type A, up to 5 display outputs
• -40 °C to +65 °C wide operating temperatures
• Wide range power input from 9 to 36 VDC
• Flexible I/O window supported via mPCIe modules

Fanless Edge AI Computer Vision System with Xilinx® Kria™ K26 SoM, GbE LAN, CANbus, PMOD, COM, USB 3.0, DisplayPort, and 5G Wireless Connection

• Xilinx® Kria™ K26 SoM
• Supports GbE LAN for cameras
• Supports 5G wireless connection
• Wide operating temperature from -30°C to +75°C
• Wide voltage input from 12 to 24 VDC
• Supports Linux
• Ideal for edge AI smart city / industrial applications

Fanless Embedded System with Intel® Celeron J6412 2.0 GHz, HDMI, VGA, 6 USB, 2 LAN, 3 COM, and 9 to 36 VDC

• Intel® Celeron® Processor J6412 quad-core onboard
• -10 °C to +60 °C operating temperature
• 1 HDMI and 1 VGA for dual-view display
• Trusted Platform Module (TPM) 2.0 onboard
• M.2 Key E for WiFi/WiFi 6 connection
• 9-36 VDC Wide range power input

Fanless Embedded System with 11th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

• 11th gen Intel® Core™ i7/i5/i3 or Celeron® Quad-core ULT processor (Tiger Lake UP3)
• Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
• Supports 3x 2.5 GbE, 6 USB, 4 COM
• -40°C to +60°C wide operating temperatures
• 9 to 48 VDC wide range DC power input
• Supports triple displays with 2 HDMI, and 1 DisplayPort++
• Intel® Iris® Xe integrated graphics (i7 & i5 SKUs)
• Trusted platform module (TPM 2.0 onboard)

Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC

• 10th/11th gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor (Comet Lake-S) up to 65W
• 4 GbE LAN and 4 COM ports
• Dual 2.5" SATA HDD drive bays
• 2 HDMI and 1 DisplayPort with dual view supported
• -40 °C to +70 °C wide operating temperatures
• Wide range power input from 9 to 48 VDC
• 1 PCIe x4 slot for I/O card
• Flexible I/O window slot for mPCIe modules

DIN-rail Fanless Embedded System with 12th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, 4 Isolated LAN, HDMI & DisplayPort, Isolated COM and DIO

• High performance with fanless & DIN-rail design
• 12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
• 4 isolated COM, isolated DIO (8-in/8-out), 4 x 2.5 GbE Isolated LAN
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
• Supports TPM 2.0
• Supports cold boot at -40°C

DIN-rail Fanless Embedded System with Intel Atom® x6212RE / x6414RE Processor, 3x Isolated LAN, Isolated COM and DIO

• Cost-effective with fanless design
• Intel Atom®   x6212RE / x6414RE processor
• 6 isolated COM, isolated DIO (8-in/8-out), 3x 2.5 GbE LAN
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
• Supports TPM 2.0
• Supports cold boot at -40°C

DIN-rail Fanless Embedded System with Intel® Celeron® Processor N3350, COM/CAN/DIO, 2 LAN, and 2 USB

• Extreme cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• COM/CAN/DIO, 2 USB, and 2 2.5GbE LAN
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• eAPI for intelligent remote monitoring software integration

Industrial System with LGA1200 Socket Intel® Xeon® or 10th Gen Core™ i7/i5/i3 Processor, Intel® W480E, Front-access I/O, and PCIe Slots

• LGA1200 Intel® Xeon® or 10th gen Core™ i7/i5/i3 processor, up to 80W
• Intel® W480E chipset
• Supports dual NVIDIA® GeForce RTX 3090 GPU cards
• Supports M.2 Key B slot for 5G wireless connection
• Supports M.2 Key E slot for Wi-Fi connection
• Supports RAID 0, 1, 5
• Supports power-on delay function
• Supports TPM 2.0

Fanless Embedded System with Intel Atom® Processor E3940 for Vehicle PC

• CE and FCC certified and ISO 7637-2 compliant
• Intel Atom® processor E3940
• Fanless and wide operating temperatures from -40°C to +70°C
• Supports 9 to 36 VDC and 12/24 VDC typical in-vehicle power input
• Compact size with multiple COM, CANBus, and DIO for communication
• Smart Ignition for power on/off schedule, vehicle battery protection, and different power modes
• Suitable for transportation gateway applications

DIN-rail cybersecurity gateway with Intel Atom® x6212RE/x6414RE processor and up to 6 LAN

• Intel Atom® x6212RE/x6414RE processor (Elkhart Lake)
• DDR4-3200 SO-DIMM, up to 32GB
• 2 GbE LAN, 2 2.5GbE LAN, and 2 SFP
• Wide operating temperature from -40°C to 70°C
• Wide power input of 9 to 36 VDC with redundant backup input
• Supports 5G with M.2 Key B 3042/3052
• Supports TPM 2.0
• Ideal for OT field site cybersecurity and secured edge

Fanless Embedded System with LGA1151 9th/8th Gen Intel® Core™ i7/i5/i3, Celeron®, Pentium®, and Xeon® Processor for Vehicle PC

• LGA1151 9th/8th Gen Intel® Core™ i7/i5/i3, Celeron®, Pentium® and Xeon® processor (up to 65W) with Intel® C246 (Coffee Lake)
• Fanless and wide operating temperatures from -40°C to +70°C
• Up to 8 GbE PoE port by RJ-45 connector type
• Supports M.2 Key B and M.2 Key E for wireless communication module
• Smart Ignition for power on/off schedule, vehicle battery protection and different power mode
• Convenient 2 hot-swappable HDD/SSD slots and flexible I/O windows
• CE, FCC and E-Mark certified

Digital Signage Player with 11th Gen Intel® Core™ i5/i3 & Celeron® Processor, 4 HDMI, 4 USB and 2.5G LAN

• 11th gen Intel® Core™ i5/i3 & Celeron® processor (Tiger Lake)
• 2 DDR4-3200 SO-DIMM for up to 64GB
• 4 HDMI 2.0 w/4K supported
• 4 USB, 1 2.5G LAN and 1 GbE LAN
• 1 M.2 Key E 2230 for Wi-Fi/BT
• 1 M.2 Key B 3052 for 5G/4G LTE
• 1 M.2 Key M 2280 for storage

Fanless Embedded System with Intel® Core™ i5-8365UE/Celeron® 4305UE Processor, HDMI/DisplayPort++, 2 GbE LAN, 2 COM, 4 USB and 9-36VDC Power Input

• 8th gen Intel® Core™ and Celeron® processor onboard (Whisky Lake-U )
• One M.2 Key E 2230 for Wi-Fi module
• 260-pin DDR4-2400 SO-DIMM, max. up to 32GB
• 2 GbE LAN and 2 USB 3.1 Gen2
• Supports DisplayPort++ and HDMI for dual independent displays
• Multiple mounting designs: Wall mount, DIN-rail and VESA mount
• 9 to 36 VDC wide range input

Fanless Embedded System with Intel® Core™ i5-8365UE/Celeron® 4305UE Processor, HDMI/DisplayPort++, 2 GbE LAN, 2 COM, 4 USB and 12VDC Power Input

• 8th gen Intel® Core™ and Celeron® processor onboard (Whisky Lake-U )
• One M.2 Key E 2230 for Wi-Fi module
• 260-pin DDR4-2400 SO-DIMM, max. up to 32GB
• 2 GbE LAN and 2 USB 3.1 Gen2
• Supports DisplayPort++ and HDMI for dual independent displays
• Multiple mounting designs: Wall mount, DIN-rail and VESA mount

Fanless Edge AI Vision System with Hailo-8™ Processor, HDMI, GbE LAN, COM, USB 3.2, DIO, and Wi-Fi/Bluetooth/5G/LTE Wireless Connection

• Hailo-8™ AI processor, up to 26 TOPS
• Palm size with high AI computing performance
• Supports dual GbE LAN for cameras
• Supports Wi-Fi/Bluetooth/5G/LTE wireless connection
• Wide operating temperature from -10°C to +60°C
• Wide voltage input from 12 to 24 VDC
• Supports Windows 10 and Linux
• Ideal for edge AI smart city applications

Fanless Embedded System with LGA1200 Socket 10th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® W480E, HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC

• LGA1200 10th gen Intel® Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
• Dual 2.5" SATA HDD drive bays with RAID 0 &1
• 2 HDMI and DisplayPort for triple view
• TPM 2.0 onboard
• AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Pentiium® processor N4200 CPU
• 4 Isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• 4 NON-Isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• 4 isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

Mini Vision System with Intel Atom® x5-E3940 Processor, Vision I/O, 2-CH PoE and 2-CH LED Output

• Integrated real-time vision I/O
  2-CH trigger input
  2-CH trigger output
  2-CH LED lighting control
  4-CH isolated DIO
• Supports camera interfaces
  2 IEEE802.3af GbE LAN ports (PoE)
• Power input: 24 VDC
• -10°C to +55°C operating temperature range
• Supports TPM 2.0 function

Fanless edge AI system with NVIDIA® Jetson Xavier™ NX SoM, 1 HDMI, 1 GbE LAN, 4 GbE PoE, 8-CH DI/DO, and 2 COM/CAN for 5G and AMR applications

• NVIDIA® Jetson Xavier™ NX with Volta™ GPU architecture with 384 NVIDIA CUDA® cores
• Advanced edge AI platform for AMR, AGV and computer vision
• Wide power input range of 12V/24VDC with ignition power control
• Supports four GbE PoE for GigE camera and LiDAR connectivity
• Wide operating temperature from -30°C to +60°C
• One M.2 Key B slot for 5G/LTE
• One 8-CH DI/DO & Two DB9 for RS-232/422/485/CAN

Industrial System with LGA1200 Socket Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 Processors, Intel® W480E, Front-access I/O and PCIe Slots

• Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 processors, up to 80W
• Intel® W480E chipset
• NVIDIA® RTX3090 GPU card support
• Supports M.2 Key B slot for 5G wireless connection
• Supports M.2 Key E slot for Wi-Fi connection
• Supports RAID 0,1
• Supports power-on delay function
• Supports TPM 2.0

• 11th Gen Intel® Core® i7/i5/i3 processor (Tiger Lake U), 15W
• Flexible I/O module for further expansion
• M.2 Key E socket for wireless connection
• 2 DisplayPort
• Supports TPM 2.0
• Supports Intel® iAMT
• Optional 1 PCIe x4 slot expansion kit
• Optional DIN-rail, bookshelf and wall mount

• NVIDIA® Jetson AGX Xavier™ with 512-core Volta GPU with 64 Tensor cores GPU
• High AI computing performance for GPU-accelerated processing
• Ideal for intelligent edge applications, AGV, AMR and computer vision
• Supports M.2 NVMe PCIe x4 SSD slot
• Wide operating temperature from -30°C to +50°C
• JetPack supported

• DIN-rail design with fanless and noiseless design
• Intel Atom® x5-E3930 processor (Apollo Lake)
• One DDR3L-1866 SO-DIMM for up to 8GB of memory
• Four GbE RJ-45 (Intel® i211)
• PCI Express Mini Card slot for wireless module
• Supports 2 COM, 4 GbE LAN, 2 USB 3.0 and 1 HDMI
• Suitable ICS cybersecurity/critical infrastructure protection