Ajoneuvo PC

14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
• 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
• 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

• Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

• Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
• Quad Independent Display (2x DP/HDMI/CMI Display)
• 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function & PoE
• Wide Operating Temperature -40°C to 70°C

12th/13th Generation Intel Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 2x PCI/PCIe Expansion Slot

12th Gen. Intel® Core™ Series High Performance and Compact Rugged Embedded Computer

• Intel® 12th Gen Alder Lake-S Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• Quad Independent Display (HDMI / DP / DVI-I)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• Safety Standard: CE, e-Mark, EN 62368-1

9/8th Gen. Intel® Core™ Series High Performance and Essential Rugged Embedded Computer

• Supports 9/8th Gen Intel® Core™ i7/i5/i3 or Pentium®/Celeron® processors (up to 65W)
• Compact size (224 x 162 x 64 mm)
• 1 x M.2 2280 key M socket, auto-detection for NVMe/SATA SSD
• 1 x M.2 2230 key E for Intel® CNVi/wireless module
• 2 x Full-size Mini PCIe sockets for module expansion
• Optional CMI/MEC modules for I/O expansion
• Wide operating temperature: -40°C to 70°C
• Military standard (MIL-STD-810G) shock & vibration proof
• Railway EMC standard EN50155 (EN 50121-3-2 only) certified

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU

• Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
• 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
• 2x full-size Mini PCIe sockets for module expansion
• 2x front-accessible SIM card slots for signal redundancy
• Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
• Optional CFM modules (power ignition sensing, or 4x PoE)
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

10.1” WXGA total IP66 design plastic panel PC, NXP iMX8M Quad Plus Processor, DDR4 4GB on board, 32GB eMMC, ISOBUS connectors, with projected capacitive touch, wide range 9~60V DC power input

• 10.1” LCD Panel, optional high brightness LED backlight LCD
• NXP i.MX8M Quad Plus Processor
• Fanless design
• Total IP66 with isolated ISOBUS connectors
• Operating system: Android 10.0
• Wide range DC 9~60V power input
• CE/FCC/E Mark

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• Onboard Intel® Pentium® N4200 Processor
• Supports Triple Independent Display
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Function (with optional CFM modules)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 2x SIM Card Socket
• Compact Size (185 x 131 x 56.5 mm)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13, No. 10R-0515075), LVD EN60950-1

9th/8th Gen Intel® Xeon®/Core™ Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor up to 8 cores
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion
• 2x DDR4 SO-DIMM sockets, up to 2666MHz, 64GB
• Supports wide operating temperature (-40°C - 70°C) and vibration/shock tolerance (5G/50G)
• 260 mm x 200 mm x 85 mm compact footprint
• Flexible functionality expansions:
  - M.2 E key (CNVi), full-size Mini-PCIe and M.2 M Key (NVMe SSD)
  - Proprietary CMI interface for various I/O expandability
  - Proprietary CFM interface for PoE+ or Power Ignition Sensing

9/8th Generation Intel® Xeon® and Core™ Processors, Extreme Performance, Compact and Modular Rugged Workstation

• Supports 9/8th Gen Intel® Xeon® and Core™ Octa/Hexa-core Processor
• Triple Independent Display with 4K/2K UHD Resolution (HDMI / DP / DVI-I)
• 2x 2.5" Hot Swap SATA HDD/SSD Tray, 3x mSATA Socket
• 2x USB 3.1 (10Gb/s) for Ultimate Data-transfer Speed
• 1x M.2 E Key Socket (CNVi), 3x Full-size Mini-PCIe Socket, 1x SIM Card Socket
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Sensing (with optional CFM modules)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13 No.10R-0515210), LVD EN62368-1, EN50121-3-2

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 7/6th-Gen Intel® Core™ i3 / i5 / i7 Socket-type CPU (LGA1151)
• 2x DDR4 SO-DIMM Socket, 2,133MHz, Supports Up to 64 GB
• Triple Independent Display (1x DVI-I, 2x DP)
• 2x 2.5" SATA HDD/SSD bay (Gen3), Supports RAID 0/1
• 2x CMI Interfaces with 6 Types of Optional Modules for I/O Expansion
• 1x CFM Interface for Adding Optional Power Ignition Sensing (IGN) Module
• Supports 3x Full-size Mini-PCIe Slot for Wireless & I/O Expansion
• Wide Operating Temperature (-40°C to 70°C)
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13, No.10R-0514229) Certified