Fanless Embedded System with LGA1700 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor, Intel® H610, 4 COM, 2 LANs, 2 HDMI, 4 USB, 8-CH DIO and 19VDC

• LGA1700 12th gen Intel® Core™ i7/i5/i3, 35W TDP
• Intel® UHD Graphics 770 by Intel® Xe Architecture with up to 32 graphics
• 8-CH DIO
• 2 HDMI for dual display outputs
• -10˚C to +50˚C wide operating temperatures
• 19VDC power input w/power protection
• Cost-effective design

• NVIDIA® Quadro® A1000 with MXM 3.1 TYPE A form factor (82 x 70 mm)
• Up to 2048 CUDA cores , 16 RT cores and 64 Tensor cores, 6.66 TFLOPS
• GDDR6 4GB memory, 128-bit, bandwidth 224 GB/s
• Up to 4 x DisplayPort 1.4a outputs
• Long life cycle, supports 5 years availability

• NVIDIA® Quadro® A500 with MXM 3.1 TYPE A form factor (82 x 70 mm)
• Up to 2048 CUDA cores , 16 RT cores and 64 Tensor cores, 6.54 TFLOPS
• GDDR6 4GB memory, 64-bit, bandwidth 112 GB/s
• Headless design, support MS-Hybrid mode only
• Long life cycle, supports 5 years availability

MXM 3.1 Type B+ NVIDIA® Quadro® Embedded A4500 with DP 1.4a

• NVIDIA® Quadro® A4500 with MXM 3.1 TYPE B+ form factor(82 x 105 mm)
• Up to 5888 CUDA cores , 46 RT cores and 184 Tensor cores, 17.66 TFLOPS
• GDDR6 16GB memory, 256-bit, bandwidth 512 GB/s
• Up to 4 x DisplayPort 1.4a outputs
• Long life cycle, supports 5 years availability

12th Generation Intel Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 2x PCI/PCIe Expansion Slot

12th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 1x PCI/PCIe Expansion Slot

12th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer

PCI Express, 200 kS/s, 16-ch, 16-bit Simultaneously Sampled AI Board with 12-ch Isolated DI

Industrial M.2 2230 Embedded Module

• Compliant with PCIe Gen3x2 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• 3D TLC flash memory
• Capacity: 64GB/ 128GB/ 512GB
• End-to-End data protection
• SLC write cache technology
• Thermal throttling technology
• Operating as boot disk
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command

Industrial M.2 2230 Embedded Module

• Compliant with PCIe Gen3x2 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• 3D TLC flash memory
• Capacity: 64GB/ 128GB/ 512GB
• End-to-End data protection
• SLC write cache technology
• Thermal throttling technology
• Operating as boot disk
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command

Industrial M.2 2230 Embedded Module

• Compliant with PCIe Gen3x2 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• 3D TLC flash memory
• Capacity: 64GB/ 128GB/ 512GB
• End-to-End data protection
• SLC write cache technology
• Thermal throttling technology
• Operating as boot disk
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command

Value-added module with 4 M12 X-coded GbE LAN and PoE

• 4 M12 X-coded PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 M12 X-coded GbE LAN

• 4 M12 X-coded GbE LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 RJ-45 GbE LAN and PoE

• 4 x RJ-45 PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 RJ-45 GbE LAN

• 4 x RJ-45 LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant