Cincoze

Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and Compact Rugged Embedded Computer

• Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
• 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
• Wide Operating Temperature -40°C to 60°C
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE

14/13/12th Generation Intel Core Series Processors, High Performance and Scalable DIN-Rail Computer

• Intel® 14/13/12th Gen Raptor Lake-S Refresh / Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 Processor
• Scalable Design with Optional Scalable Expansion Deck for I/O Modules Expansion
• Compact Size with DIN-Rail Mount Support
• Supports Dual PCIex4 NVMe SSD with RAID Function

Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and Expandable Rugged Embedded Computer

• Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
• 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
• Optional CMI Modules for I/O Expansion
• Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE
• Wide Operating Temperature -40°C to 60°C

Intel® Arrow Lake-S Core™ Ultra 200S Series Processors, High Performance and PCIe Expandable Rugged Embedded Computer, Supporting up to 2x PCI/PCIe Expansion Cards

• Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP)
• 2x DDR5 SODIMM/CSODIMM Sockets, Up to 6400MHz, 96GB
• 2x PCI/PCIe Expansion Slots, Up to 130W Expansion
• Optional CMI Modules for I/O Expansion
• Optional CFM Modules for Hardware TPM, Ignition Sensing & PoE
• Wide Operating Temperature -40°C to 60°C

Intel Meteor Lake-PS Core Series (LGA Socket) Slim Embedded Computer with CDS Technology

• Intel® Meteor Lake-PS Core™ Ultra 7/5/3 Processor
• 2x DDR5 SO-DIMM Socket, Supports up to 5600MHz 64GB Memory
• 1x M.2 Key E Type 2230 Socket for Wireless / Bluetooth Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 3042 Socket for Storage/Add-on Card Expansion
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• Optional CFM Module for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 65°C
  
  

Intel® Alder Lake-N Processor Entry Performance and Compact Rugged Embedded Computer

• Onboard Intel® Alder Lake-N Processor N97 and Core™ i3-N305 Processor
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 16GB Memory
• 1x M.2 Key B Type 3052/3042 Socket for 5G Module Expansion
• 1x M.2 key B Type 2242 Socket for I/O Module Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function

14/13/12th Gen Intel® Core™ Modular GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• 4x 2.5GbE LAN and optional 2x 10GbE LAN
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2280 Socket for Add-on Card Expansion
• 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm) , 1x M.2 key M for NVMe SSD
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Versatile Mounting Methods (Tower Stand / Desktop / 19”Rack / Vehicle Mount)
• Wide Operating Temperature -40°C to 70°C

14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
• 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
• 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Intel Alder Lake-N Processor Rugged Embedded Computer

• Onboard Intel ® Alder Lake-N Processor N97
• Onboard Intel Alder Lake-N Atom® x7425E
• Ultra Compact Size (150 x 105 x 52.3 mm)
• 1 x DDR5 SO-DIMM Sockets, Supports Up to 4800MHZ, 16GB
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI modules for I/O expansion
• Wide Operating Temperature -40°C to 70°C

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

• Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

• Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
• Quad Independent Display (2x DP/HDMI/CMI Display)
• 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function & PoE
• Wide Operating Temperature -40°C to 70°C

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

12th/13th Generation Intel Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 2x PCI/PCIe Expansion Slot

12th/13th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 1x PCI/PCIe Expansion Slot

12th/13th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer

Mini PCI-e 2-port 2.5GbE isolated Ethernet board (-40℃~+85℃) / 1x Universal Bracket with 2x RJ45 Cutout

12th Gen. Intel® Core™ Series High Performance and Compact Rugged Embedded Computer

• Intel® 12th Gen Alder Lake-S Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• Quad Independent Display (HDMI / DP / DVI-I)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• Safety Standard: CE, e-Mark, EN 62368-1

Intel® Elkhart Lake Atom® x6000E Series Processor Slim Embedded Computer with CDS Technology

• Intel® Elkhart Lake Atom® x6425E/x6211E Processor
• 1x DDR4 SO-DIMM
• 1x M.2 Key E Type 2230 Socket for Intel® CNVi/Wireless Module
• CFM Technology for Power Ignition Sensing Function and PoE Function

9/8th Gen. Intel® Core™ Series High Performance and Essential Rugged Embedded Computer

• Supports 9/8th Gen Intel® Core™ i7/i5/i3 or Pentium®/Celeron® processors (up to 65W)
• Compact size (224 x 162 x 64 mm)
• 1 x M.2 2280 key M socket, auto-detection for NVMe/SATA SSD
• 1 x M.2 2230 key E for Intel® CNVi/wireless module
• 2 x Full-size Mini PCIe sockets for module expansion
• Optional CMI/MEC modules for I/O expansion
• Wide operating temperature: -40°C to 70°C
• Military standard (MIL-STD-810G) shock & vibration proof
• Railway EMC standard EN50155 (EN 50121-3-2 only) certified

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU

• Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
• 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
• 2x full-size Mini PCIe sockets for module expansion
• 2x front-accessible SIM card slots for signal redundancy
• Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
• Optional CFM modules (power ignition sensing, or 4x PoE)
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

9th/8th Gen Intel® Xeon®/Core™ GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor (35W / 65W / 80W)
• 2 x DDR4 SO-DIMM Sockets, Supports ECC/non ECC type up to 2666 MHz, 64GB
• 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm)
• 1 x M.2 M Key Socket (NVMe), 1 x M.2 E Key Socket (CNVi)
• 2 x Front Accessible SIM Card Slots for Signal Redundancy
• CMI Technology for Various I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Versatile Mounting Methods (Wall / Stand / Face-up / 19" Rack Mount)
• Military Standard Shock & Vibration Proof

• Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
• 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
• Triple Independent Display (DVI-I, DisplayPort)
• Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
• 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
• Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
• Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
• Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
• Cincoze MEC Module Kits for Various I/O Expansion
• 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
• Wide Operating Temperature (-40°C to 70°C)
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13, No. 10R-0514273) Certified for In-vehicle Application

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• Onboard Intel® Pentium® N4200 Processor
• Supports Triple Independent Display
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Function (with optional CFM modules)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 2x SIM Card Socket
• Compact Size (185 x 131 x 56.5 mm)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13, No. 10R-0515075), LVD EN60950-1

• Onboard Intel® Atom® / Pentium® Processor
• 1x DDR3L SO-DIMM max. up to 8GB
• Triple Independent Display (1x CDS, 1x VGA, 1x DisplayPort)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• Rich I/O (2x LAN, 4x USB, 4x COM, 8x Isolated DIO)
• 2x Full Size Mini-PCIe Expansion Socket
• Supports 2x PoE+ Function (with optional CFM module)
• Supports Ignition Sensing Function (IGN) (with optional CFM module)
• Supports CDS Technology for Convertible Panel PC
• Built-in Two 2W Internal Speakers

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 2x PCI/PCIe Slots for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 9/8th Gen Intel® Core™  35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 1x PCI/PCIe Slot for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

9th/8th Gen Intel® Xeon®/Core™ Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor up to 8 cores
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion
• 2x DDR4 SO-DIMM sockets, up to 2666MHz, 64GB
• Supports wide operating temperature (-40°C - 70°C) and vibration/shock tolerance (5G/50G)
• 260 mm x 200 mm x 85 mm compact footprint
• Flexible functionality expansions:
  - M.2 E key (CNVi), full-size Mini-PCIe and M.2 M Key (NVMe SSD)
  - Proprietary CMI interface for various I/O expandability
  - Proprietary CFM interface for PoE+ or Power Ignition Sensing

Industrial Mini PCIe USB Expansion Card

• Single-Lane (x1) PCI-Express with throughput up to 5.0/2.5Gbps
• Fully compliant with PCI-Express Base Specification Rev 2.0 Two USB 3.2 Super-Speed ports
• USB data transfer rate of 1.5/12/480/5000 Mbps
• Support simultaneous operation of multiple USB 1.1, USB 2.0, and USB 3.2 GEN1x1 devices
• Universal Serial Bus 3.2 specification Revision 1.0 compliant
• Support Hot-Swap function

   

9/8th Generation Intel® Xeon® and Core™ Processors, Extreme Performance, Compact and Modular Rugged Workstation

• Supports 9/8th Gen Intel® Xeon® and Core™ Octa/Hexa-core Processor
• Triple Independent Display with 4K/2K UHD Resolution (HDMI / DP / DVI-I)
• 2x 2.5" Hot Swap SATA HDD/SSD Tray, 3x mSATA Socket
• 2x USB 3.1 (10Gb/s) for Ultimate Data-transfer Speed
• 1x M.2 E Key Socket (CNVi), 3x Full-size Mini-PCIe Socket, 1x SIM Card Socket
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Sensing (with optional CFM modules)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13 No.10R-0515210), LVD EN62368-1, EN50121-3-2

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Onboard 8th Generation Intel® Core™ U Series Processor
• 2x DDR4 SO-DIMM Socket, Supports Up to 2400MHz, 64GB
• Supports Triple Independent Display
• Integrated USB 3.2 Gen 2 supports up to 10Gbps
• M.2 E Key Socket for Wireless Module or Intel CRF Module
• Supports Ignition Sensing Function (IGN) (with optional CFM module)
• Supports 2x PoE+ Function (with optional CFM module)
• 1x PCI or 1x PCIe Slot for Add-on Card Expansion: Max. Length 180mm (with optional riser card)
• Supports CDS Technology for Convertible Panel PC
• Built-in Two 2W Internal Speakers

• Onboard 8th Generation Intel® Core™ U Series Processor
• 2x DDR4 SO-DIMM Socket, Supports Up to 2400MHz, 64GB
• Supports Triple Independent Display
• Integrated USB 3.2 Gen 2 supports up to 10Gbps
• M.2 E Key Socket for Wireless Module or Intel CRF Module
• Supports Ignition Sensing Function (IGN) (with optional CFM module)
• Supports 2x PoE+ Function (with optional CFM module)
• Supports CDS Technology for Convertible Panel PC
• Built-in Two 2W Internal Speakers

M.2 2280 (B+M key) 2-port 1GbE SFP Ethernet board (-40℃~+85℃)

• Single-Lane (x1) PCI-Express with throughput up to 5.0/2.5GT/s
• Standard SFP modules supporting data rates of up to 1Gbps
• IEEE 802.3 for 1000Base-SX/1000Base-LX, IEEE 802.3ap for 1000Base-KX, PICMG 3.1 for 1000Base-BX
• Support Wake-on-LAN and Hot-Swap function
• Allowing for long-distance communication and easy upgrades
• Modular Design, flexibility and scalability
• Support multiple SFP ports, both single-mode or multi-mode

M.2 2280 (B+M key) 1-port 1GbE SFP Ethernet board (-40℃~+85℃)

• Single-Lane (x1) PCI-Express with throughput up to 5.0/2.5GT/s
• Standard SFP modules supporting data rates of up to 1Gbps
• IEEE 802.3 for 1000Base-SX/1000Base-LX, IEEE 802.3ap for 1000Base-KX, PICMG 3.1 for 1000Base-BX
• Support Wake-on-LAN and Hot-Swap function
• Allowing for long-distance communication and easy upgrades
• Modular Design, flexibility and scalability
• Support multiple SFP ports, both single-mode or multi-mode