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Muokkaa DI-1200

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    Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

    • Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
    • 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
    • Quad Independent Display (2x DP/HDMI/CMI Display)
    • 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
    • 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
    • CMI Technology for Optional I/O Module Expansions
    • CFM Technology for Power Ignition Sensing Function & PoE
    • Wide Operating Temperature -40°C to 70°C
    Processor Onboard 12th Intel® Alder Lake-P U-Series CPU:
    - Intel® Core™ i7-1265UE 10 Cores Up to 4.70 GHz, TDP 15W
    - Intel® Core™ i5-1245UE 10 Cores Up to 4.40 GHz, TDP 15W
    - Intel® Core™ i3-1215UE 6 Cores Up to 4.40 GHz, TDP 15W
    Security Hardware  
    Chipset SoC
    Storage 1x 2.5” SATA HDD/SSD Bay
    1 x M.2 SSD shared by M.2 Key B Type 3052 Socket
    Support RAID 0/1
    Storage Support  
    Memory 1x DDR5 SO-DIMM Socket, Support Up to 32GB
    Graphics Integrated Intel® Iris® Xe Graphics: Core™ i7-1265UE, i5-1245UE
    Integrated Intel® UHD Graphics: Core™ i3-1215UE
    I/O Ports
    USB 2.0 3 x USB2.0
    USB 3.0 2x USB 3.2 (5Gbs)
    1x USB 3.2 (10Gbs)
    Serial 2x RS-232/422/485
    Video 1 x HDMI
    2 x DisplayPort
    Optional: DP, HDMI or VGA (4th monitor)
    Ethernet 2x GbE LAN , RJ-45 (Intel I225)
    Other Ports Mic-in/Line-out
    1x Remote Power On/Off Connector
    1x Remote Power LED
    Expansion Interface 1x CFM Interface (Control Function Module)
    1x CMI (Combined Multiple I/O) (for extra LAN module)
    1x CMI (Combined Multiple I/O) (for extra COM/DIO module)
    1x M.2 Key E type 2230 Socket, Support Wireless
    1x M.2 Key B type 3042/3052 Socket, Support 5G/Storage/Add-on Card expansion
    2x SIM Socket
    Operating System
    Operating System Windows® 10
    DC Input / Source Voltage Power Input Voltage 9~48VDC
    Cooling System / Thermal Solution
    Thermal Solution Passive - Fanless
    Dimensions / Weight
    Weight (kg) 1.8 kg
    Dimensions 203 x 142 x 67 mm
    Environment & Reliability
    Power protection Reverse Power input protection
      Over Voltage, Over Current
    MTBF 486,235 h
    Operating Temperature -40°C ~ +70°C with W.T. SSD, 15W TDP CPU
    Humidity Range 10% ~ 95%, non-condensing
    Shock MIL-STD-810H
    Vibration MIL-STD-810H
    EMI • CISPR 32 Conducted & Radiated: Class A
    • EN/BS EN 50121-3-2 Conducted & Radiated: Class A
    • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
    • EN/BS EN 61000-3-3 Voltage fluctuations & flicker
    • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
    EMS • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
    • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
    • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 2 kV; Signal: 2 kV
    • EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV
    • EN/IEC 61000-4-6 CS: 10V
    (**Compliant with the standard when utilizing shielded cable.)
    • EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m
    • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz
    Material Aluminum / Steel
    Mounting Desk / Wall mounting / DIN-Rail/ VESA mount
    Design guide • Fanless Design
    • Cableless Design
    • Jumper-less Design
    • Unibody Design
    Peripherals & Devices
    Accessories Optional Modules
    Extra Features  
    Certification CE, UKCA, FCC, ICES-003 Class A
    • EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only)
    • EN 50155 (EN 50121-3-2 Only)
    • E-mark

    Valmistaja / BrandCincoze
    CPU FamilyAlder Lake (12th Gen Core i3/i5i7/i9)
    Operating TempWide Temp -40..70C