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ICO520

Tuotenro
ICO520
Toimitusaika 21-30pv

1 407,40 EUR 1 135,00 EUR

DIN-rail Fanless Embedded System with 12th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, 4 Isolated LAN, HDMI & DisplayPort, Isolated COM and DIO

  • High performance with fanless & DIN-rail design
  • 12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
  • 4 isolated COM, isolated DIO (8-in/8-out), 4 x 2.5 GbE Isolated LAN
  • Wide operating temperature range from -40°C to +70°C
  • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
  • Supports TPM 2.0
  • Supports cold boot at -40°C
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Tuote
ICO520
ICO520

1 407,40 EUR 1 135,00 EUR

Yhteenveto
    System
    Processor Intel® Core™ i7-1265UE (up to 4.7GHz/10C/15W)
    Intel® Core™ i5-1245UE (up to 4.4GHz/10C/15W)
    Intel® Core™ i3-1215UE (up to 4.4GHz/6C/15W)
    Intel® Celeron® 7305E (1GHz/5C/15W)
    Security Hardware TPM2.0
    Chipset SoC integrated
    Storage 1 x mSATA (occupied 1 x PCI Express Mini Card slot)
    1 x Internal 2.5" SATA drive (9.5 mm height)
    1 x 8G eMMC on board
    Memory 1 x DDR4-3200 SO-DIMM, up to 32GB
    Graphics  
    I/O Ports
    USB 2.0  
    USB 3.0 4x USB3.1
    Serial 4 x Isolated RS-232/422/485 (4-wire, Phoenix Type)
    Isolation voltage: 1.5 kV
    Video 1 x HDMI
    1 x DP
    Ethernet 4 x RJ-45 isolated 2.5 GbE LAN (Intel® i226-IT)
    Isolation voltage: 1.5 kV
    Other Ports Isolated DIO 8-bit
    Expansion
    Expansion Interface 1 x M.2 (USB3.0, PCIe; for 5G & NVMe)
    1 x Full-size Rev.1.2 PCI Express Mini Card slot with PCIe and USB signal (for LTE/Wi-Fi module)
    1 x Full-size Rev.1.2 PCI Express Mini Card slot with USB/mSATA signal (for Wi-Fi/mSATA)
    2 x SIM slot (1 for M.2; 1 for full-size PCI Express Mini Card)
    Operating System
    Operating System Windows® 10 / LINUX
    Power
    DC Input / Source Voltage 1 x Terminal block, 9 to 36 VDC, typical 12/24V
    Operating Temperature
    Operating Temperature -40°C ~ +70°C with W.T. SSD
    Humidity Range 0% ~ 95%, non-condensing
    Cooling System / Thermal Solution
    Thermal Solution Passive - Fanless
    Dimensions / Weight
    Weight (kg) 1.0 kg
    Dimensions 83 x 110 x 155 mm
    Enclosure
    Material Aluminum / Steel
    Mounting Din-rail , Wall Mounting
    Certification
    Certification CE (Class A), FCC (Class A)
    Lisätietoja
    JäähdytysFanless
    CPU FamilyAlder Lake (12th Gen Core i3/i5i7/i9)
    Operating TempWide Temp -40..70C