Computers

Industrial 2.5" U.2 SSD, Wide-Temp,  iCell

• PCIe Gen. 4x4, NVMe 1.4
• Excellent data transfer speed
• Heat-spreading design
• LDPC ECC engine supported.
• End-to-end Data Path Protection
• High capacity & ultra-speed

Industrial 2.5" SATA SSD, Wide-Temp, iDataGuard, iCell

• 2.5” SATA III solution for industrial field
• High IOPS
• iSMART disk health monitoring
• End to end data path protection
• iData Guard for abnormal power failure
• iCell technology for data protection

Industrial 2.5" SATA SSD, Wide-Temp, iDataGuard, iCell

• 2.5” SATA III solution for industrial field
• High IOPS
• iSMART disk health monitoring
• End to end data path protection
• iData Guard for abnormal power failure
• iCell technology for data protection

Industrial 2.5" SATA SSD, Wide-Temp, iDataGuard, iCell

• 2.5” SATA III solution for industrial field
• High IOPS
• iSMART disk health monitoring
• End to end data path protection
• iData Guard for abnormal power failure
• iCell technology for data protection

Industrial 2.5" SATA SSD, Wide-Temp, iDataGuard, iCell

• 2.5” SATA III solution for industrial field
• High IOPS
• iSMART disk health monitoring
• End to end data path protection
• iData Guard for abnormal power failure
• iCell technology for data protection

Ruggedize AI Inference System Based on NVIDIA® Jetson™ Xavier NX. This in-vehicle AI system is compact, IP67 rated, waterproof fanless design.

• Ruggedized IP67 waterproof fanless design
• Embedded with NVIDIA® Jetson Xavier™ NX up to 21 TOPS
• 2 x GbE and 4 x PoE with IEEE 802.3af compliance
• 2 x USB 3.0, 2 x CANbus, 1 x HDMI
• Linux OS with board support package (BSP)
• Supports Allxon 24/7 remote monitoring and OTA deployment

Mini-ITX SBC with LGA1700 Socket 12th Gen Intel® Core™ Processor, Intel® Q670E, 2 HDMI, DisplayPort++, eDP, 2 GbE LAN, and HD Audio

• LGA1700 socket 12th gen Intel® Core™ i7/i5/i3 processor
• Intel® Q670E chipset
• 2 DDR4 SO-DIMM for up to 64GB of memory
• 4 USB 3.2 and 4 USB 2.0
• 4 COM ports
• 2 SATA-600 and 1 M.2 Key M 2280
• 1 PCIe x16, 1 M.2 Key E 2230, and 1 M.2 Key B 3052/3042

PCI Express, 200 kS/s, 16-ch, 16-bit Simultaneously Sampled AI Board with 12-ch Isolated DI

Industrial M.2 2230 Embedded Module, A+E key

• Compliant with PCIe Gen3x2 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• 3D TLC flash memory
• Capacity: 64GB/ 128GB/ 512GB
• End-to-End data protection
• SLC write cache technology
• Thermal throttling technology
• Operating as boot disk
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command

Industrial M.2 2230 Embedded Module, A+E key

• Compliant with PCIe Gen3x2 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• 3D TLC flash memory
• Capacity: 64GB/ 128GB/ 512GB
• End-to-End data protection
• SLC write cache technology
• Thermal throttling technology
• Operating as boot disk
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command

Industrial M.2 2230 Embedded Module, A+E key

• Compliant with PCIe Gen3x2 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• 3D TLC flash memory
• Capacity: 64GB/ 128GB/ 512GB
• End-to-End data protection
• SLC write cache technology
• Thermal throttling technology
• Operating as boot disk
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command

M.2 2280 to four isolated CANbus 2.0B module

• Compliant with PCI Express 1.1
• Meet the Requirements of the ISO 11898-1
• CAN bus 2.0B backward compatible with 2.0A
• Support baud rate 10/20/50/100/250/500/800/1000K
• Support CAN message acceptance filter
• Support Linux SocketCAN
• Support SAE J1939/CANopen high layer protocol (Optional)
• Compliant with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection
• Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Termination resistor enabled/disabled by switch
• 30μ” golden finger, 3-year warranty
• Industrial Temperature (-40°C to +85°C) support

M.2 2280 to dual isolated CAN bus Module

• Compliant with PCI Express 1.1
• Meet the Requirements of the ISO 11898-1
• CAN bus 2.0B backward compatible with 2.0A
• Support baud rate 10/20/50/100/250/500/800/1000K
• Support CAN message acceptance filter
• Support Linux SocketCAN
• Support SAE J1939/CANopen high layer protocol (Optional)
• Compliant with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection
• Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Termination resistor enabled/disabled by switch
• 30μ” golden finger, 3-year warranty
• Industrial Temperature (-40°C to +85°C) support

Thin Mini-ITX SBC with LGA1700 12th Gen Intel® Core™ i9/i7/i5/i3, HDMI, VGA, LVDS, USB 3.2, M.2, and Dual GbE LAN

• LGA1700 12th gen Intel® Core™ i9/i7/i5/i3 processor
• Intel® H610 chipset
• 2 DDR4 SO-DIMM for up to 64GB memory
• 2 USB 3.2 Gen1 and 5 USB 2.0
• 1 2.5GbE LAN and 4 COM ports
• 1 PCIe x16, 1 M.2 Key E and 1 M.2 Key B
• 1 full-size mini-PCIe slot
• 1 SATA-600
• 12 to 24 VDC power in

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen3x4 interface
• Compliance: NVMe 1.3/ PCI Express Base 3.1
• TLC NAND flash memory
• Capacity: 240GB ~ 1920GB
• With DRAM Buffer
• Powerguard Function (Power Loss Protection)
• Support AES 256-bit Encryption
• End-to-End data protection
• Dynamic Thermal throttling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen 4x4 interface
• Compliance: NVMe 1.4/ PCI Express Base 4.0
• TLC NAND flash memory
• Capacity: 480GB ~ 3840GB
• With DRAM Buffer
• End-to-End data protection
• SLC write cache technology
• Dynamic Thermal throttling
• Operating as boot disk
• Static and dynamic wear leveling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen 4x4 interface
• Compliance: NVMe 1.4/ PCI Express Base 4.0
• TLC NAND flash memory
• Capacity: 480GB ~ 3840GB
• With DRAM Buffer
• End-to-End data protection
• SLC write cache technology
• Dynamic Thermal throttling
• Operating as boot disk
• Static and dynamic wear leveling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen 4x4 interface
• Compliance: NVMe 1.4/ PCI Express Base 4.0
• TLC NAND flash memory
• Capacity: 480GB ~ 3840GB
• With DRAM Buffer
• End-to-End data protection
• SLC write cache technology
• Dynamic Thermal throttling
• Operating as boot disk
• Static and dynamic wear leveling

Industrial M.2 2280 Embedded Module

• Compliant with PCIe Gen 4x4 interface
• Compliance: NVMe 1.4/ PCI Express Base 4.0
• TLC NAND flash memory
• Capacity: 480GB ~ 3840GB
• With DRAM Buffer
• End-to-End data protection
• SLC write cache technology
• Dynamic Thermal throttling
• Operating as boot disk
• Static and dynamic wear leveling

Mini-ITX SBC with LGA1700 12th Gen Intel® Core™ i9/i7/i5/i3, DisplayPort++, HDMI, VGA, LVDS, USB 3.2, M.2, and Dual GbE LAN

• LGA1700 12th gen Intel® Core™ i9/i7/i5/i3 processor
• Intel® H610 chipset
• 2 DDR4 SO-DIMM for up to 64GB of memory
• 2 USB 3.2 Gen1 and 5 USB 2.0
• 4 COM port
• 1 PCIe x16 and 1 M.2 Key E slot
• 1 Full-size mini-PCIe slot
• 1 SATA-600
• 1 M.2 Key B for USB 3.2 interface 5G module

Thin Mini-ITX SBC with Intel® Celeron® Processor J6412, HDMI, VGA, LVDS, USB 3.1, Mini PCIe, M.2 Key B, and HD Audio

• Intel® Celeron® processor J6412
• 2 DDR4 SO-DIMM for up to 32GB of memory
• 1 PCIe x2 for PCIe x4 expansion slot
• 1 PCI Express Mini Card slot and PCIe x1
• 4 USB 3.1 and 4 USB 2.0
• 1 SATA-600 and 1 M.2 Key B
• Supports 6 COM
• Low profile
• 9 to 20 VDC power in
• HDMI/VGA/LVDS with triple view supported

• 21.5" Full-HD capacitive touchscreen for industrial applications.
• HDMI, DVI and VGA inputs. USB for touch.
• Aluminium frame. IP65 protected frontpanel.
• VESA-mounting
• Brightness 350nits
• Native resolution 1920x1080. Aspect ratio 16:9.
• Operating temp -10C - 60C
• Operating voltage DC12V