Tietotekniikka

Intel Alder Lake-N Processor N97 Rugged Embedded Computer

• Onboard Intel ® Alder Lake-N Processor N97
• Ultra Compact Size (150 x 105 x 52.3 mm)
• 1 x DDR5 SO-DIMM Sockets, Supports Up to 4800MHZ, 16GB
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI modules for I/O expansion
• Wide Operating Temperature -40°C to 70°C

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

• Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

• Hyper-fast scrolling
• 1 000 DPI laser precision
• Soft side grips and a contoured design
• Backward/forward buttons
• Plug-and-play USB

CDS Monitor Module with 1x DisplayPort, 1x HDMI, 1x VGA

• Various Video Input Interfaces: 1x VGA, 1x HDMI, 1x DisplayPort Input
• Support USB & RS-232 Interfaces for Touch Function
• OSD Control keys for Brightness Adjustment
• Convertible Display System (CDS) Supported
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2
• Safety Certification: UL, cUL, CB, IEC, EN 62368-1

Fanless Embedded System with 13th Gen Intel® Core™ i7/i5/Celeron® Processor, 2 HDMI, 2 LANs, 8 USB, 2 COM, and 12 VDC

• 13th gen Intel® Core™ processor (Raptor Lake P)
• Fanless design with operating temperature from -20°C to 60°C
• 1 DDR4 SO-DIMM for up to 32GB of memory
• Intelligent power ignition management and USB power on/off control
• Supports high-speed NVMe storage (M.2 Key M 2280)
• Excellent heat-dissipation DIN-rail system
• Supports Intel® vPro and TPM 2.0

21.5" FHD TFT Multi-touch Panel Computer with Intel® Celeron® Processor J6412

• 21.5" FHD projected capacitive multi-touch widescreen
• Fanless design with Intel® Celeron® processor J6412
• Supports WLAN module and antenna (optional)
• 2.5" SATA SSD
• 2 LAN, 4 USB, 1 COM, 1 HDMI, and 1 VGA
• IP65-rated aluminum front bezel
• Supports panel mount, VESA mount, desktop stand, and wall mount

18.5" FHD TFT Multi-touch Panel Computer with Intel® Celeron® Processor J6412

• 18.5" FHD projected capacitive multi-touch widescreen
• Fanless design with Intel® Celeron® processor J6412 (Elkhart Lake)
• Supports WLAN module and antenna (optional)
• 2.5" SATA SSD
• 2 LAN, 4 USB, 1 COM, 1 HDMI, and 1 VGA
• IP65-rated aluminum front bezel
• Supports panel mount, VESA mount, desktop stand, and wall mount
• Supports proximity and ambient light sensors (optional)

Intel® Alder Lake-N Platform, Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-N Processor N97 and Atom® x7425E Processor
• 1 x DDR5 SO-DIMM Socket, Supports up to 4800MHz & 16GB Memory
• 1 x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

• Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
• Quad Independent Display (2x DP/HDMI/CMI Display)
• 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function & PoE
• Wide Operating Temperature -40°C to 70°C

• 1280x800 Native resolution, 16:9 wide
• High quality IPS panel
• HDMI and VGA
• 1x Video/audio input
• VESA75
• DC12V & 230V AC adapter

• 200mm x 100mm x 3mm
• 6W / mK heat conductivity

• 14-inch tablet, 1920 x 1080 wide viewing angle LED Panel
• 11th Gen. Intel® Processor Family – Tiger Lake Processor
• Optical bonding and Antiglare technology for sunlight readability
• IP65 water and dust proof with MIL-STD-810H rugged housing
• Hot-swappable battery for whole day work

• 13.3” 1920 x 1080 IPS wide viewing angle LED panel
• Intel® Core™ i5-­1135G7 Tiger Lake processor
• Removeable kickstand usable as carrying handle
• Magnesium alloy housing with all­around elastomeric rubber
• IP65 waterproof and dustproof
• Fanless cooling system

• 13th generation Intel® Processor Family – Raptor Lake Processor
• 15.6” FHD Panel resolution with PCAP touch
• Optional discrete Nvidia Graphic card
• Dual battery with hot-swappable design for whole-day-work
• Anti-glare technology for sunlight readability
• Magnesium alloy enclosure with double injection for drop protection
• IP65 waterproof and dustproof
• Utilizing Nvidia T1000 and A2000 Graphic Cards

• 13th generation Intel® Processor Family – Raptor Lake Processor
• 15.6” FHD Panel resolution with PCAP touch
• Dual battery with hot-swappable design for whole-day-work
• Anti-glare technology for sunlight readability
• Magnesium alloy enclosure with double injection for drop protection
• IP65 waterproof and dustproof

• 12th Gen. Intel® Processor Family – Alder Lake Processor
• 14” 1920 x 1080 FHD LED panel with direct optical bonding
• Anti­glare technology for sunlight readability
• Dual battery with hot­swappable design for whole­day ­work
• Flip design for quick switching between rugged laptop and rugged tablet modes
• Magnesium alloy enclosure with double injection for drop protection

• 12th Gen. Intel® Processor Family – Alder Lake Processor
• 13.3” 1920 x 1080 LED panel with direct optical bonding laptop
• Anti­glare technology for sunlight readability
• Dual battery with hot­swappable design for whole­day ­work
• Flip design for quick switching between rugged laptop and rugged tablet modes
• Magnesium alloy enclosure with double injection for drop protection

• FULL-HD 1920x1080 natiiviresoluutio 16:9 kuvasuhteella.
• HDMI, DP, VGA - sisääntulot.
• VESA75 asennus.
• Toimintajännite DC 7-24V DC.

Fanless Embedded System, Intel 12th Gen i5 CPU, 2x HDMI, 2x GbE LAN, 6x USB, 2x COM

• 12th Gen Core-i CPU, i5-1235U Ultra Low Voltage
• 2.5" SATA SSD bay
• Support M.2 NVME SSD
• Dual HDMI display
• 90W power adapter for more power hungry applications
• 3x USB3.1 & 3xUSB2.0
• 2x GbE LAN, RJ-45
• 2x COM RS-232

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

DIN-Rail Cybersecurity Gateway with Intel Atom® x5-E3930/E3940 Processor and 4 LAN with LAN Bypass

• Cost-effective with fanless design
• Intel Atom® x5-E3930/E3940 processor (Apollo Lake)
• 4 GbE RJ-45 (Intel® I210-IT) with LAN Bypass
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
• Supports TPM 2.0
• Ideal for ICS cybersecurity and critical infrastructure protection

17" SXGA Fanless Touch Panel Computer with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 & Pentium® Processor

• 17” SXGA LCD with 350 nits of brightness
• 5-wire resistive touch
• Supports one 2.5” SATA HDD/SSD
• Flat front panel touch screen with rugged IP65 front bezel
• Fanless design
• Supports WLAN module & antenna (optional)
• Supports 4 USB & 2COM ports
• TPM 2.0 onboard
• Swappable HDD Tray
• Supports panel mount, VESA mount, desktop stand, and wall mount

Fanless Edge AI System with NVIDIA® Jetson Orin™ NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, and 8-CH DIO for AMR & Robotics

• NVIDIA® Jetson Orin™ NX (100 TOPS)
• Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
• Easily manage: USB and PoE device power control
• Supports dual PoE for camera & sensor connectivity
• -25°C to +60°C operating temperature range
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Edge AI Developer Kit with NVIDIA® Jetson Orin™ NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Edge AI Developer Kit with NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Compact DIN-Rail Edge Controller with 11th Gen Intel® Core™ i CPU

• Port isolation for 8 x DI, 8 x DO, 4 x COM
• Supports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modules
• Dual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technology
• Remote out-of-band (OOB) power management with Advantech iBMC technology
• Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified

Small-Size Integrated DIN-Rail IPC with Intel® Atom® x6425RE

• Intel® Atom®  x6425RE (1.9GHz) processor with 8GB DDR4 memory
• Wide operating temperature range (-40 ~ 70 °C) and wide power input range (10 ~ 36 VDC)
• Port isolation for 8 x DI, 8 x DO, 2 x COM
• DP++ ensures HDMI/DVI compatibility
• Dual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATA
• Onboard TPM 2.0 provides hardware-based security
• Modular design for optional iDoor extension
• Ruggedized DIN-rail kit
• Compliant with IEC 61010-1 safety requirements

Intel® 2nd Gen. Xeon® D-1700 Extreme Performance Box PC with 3 Expansion Slots

• Powered by Intel® 2nd Gen. Xeon® D-1700 series processor up to 10 cores
• 4x DDR4 SO-DIMM sockets support ECC/non-ECC memory up to 128GB
• Versatile expansion options with PCI, PCIex4, PCIex16, M.2 B Key and E key
• Support PCIex16 high performance graphic card up to 350W
• 2x 10GbE port for fast data communication (optional)
• Up to 4 x 2.5" SATAIII HDD bay
• IPMI 2.0-compliant management with reliability and security enhancements

• Fanless embedded system
• Intelligent power management Ignition, USB power on/off control
• EN 61000-6-2 certified
• Optional DIN-rail, bookshelf and wall mount kits
• Optional PCIEx16 -slot

Intel Atom x6413E QC SoC with GbE, COM, USB, HDMI/DP and DIO ports DIN-Rail Fanless Box PC

• Intel Atom® x6413E Quad Core
• DIN-Rail system with essential I/O ports on front-side bezel
• 2 x Intel GbE and 2 x RS-232/422/485
• Dual independent displays with one 4K HDMI and one 4K DP
• 2 x USB 3.2 and 2 x USB 2.0, 1 x internal USB2.0 for security dongle
• 1 x M.2 2280 B key with nano SIM holder and 1 x M.2 2230 E key, 1 x full-size mPCIe
• mSATA and 1 x 2.5" SATA storage device
• 12V ~ 28V wide range power input, -40 ~ 60 °C extended operating temperature

Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC

• i3-1115G4E CPU /Core i5-1145G7E
• DIN-Rail system with essential I/O ports on front-side bezel
• 3 x Intel GbE, 4x RS-232/422/485
• 3 x USB 3.2 and 3 x USB 2.0, dual independent displays with one 4K HDMI and one VGA
• 3 Expansion: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot
• mSATA and 1 x 2.5" SATA storage device
• 12V ~ 24V wide range power input
• -40 ~ 60 °C extended operating temperature
• WISE-DeviceOn supported for quick AI deployment at scale

12th &13th Gen Intel® Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC, PCIEx16 & 2x PCI

• Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor
• Triple independent display: HDMI + HDMI + Optional Display
• DDR5 SO-DIMM memory support up to 64 GB
• 9-36VDC wide range power input
• Up to 3sets 2.5" hard drive bays
• Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
• SUSI API, WISE-DeviceOn, McAfee and Acronis bundled

12th &13th Gen Intel® Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC, PCIEx16, PCIEx4

• Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor
• Triple independent display: HDMI + HDMI + Optional Display
• DDR5 SO-DIMM memory support up to 64 GB
• 9-36VDC wide range power input
• Up to 3sets 2.5" hard drive bays
• Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
• SUSI API, WISE-DeviceOn, McAfee and Acronis bundled

Digital I/O Board with isolation

• Contact rating: DC 80V / 50mA max
• Isolation Protection: 3750Vrms

32 GPIO extension card, mpcie

Intel® 12th / 13th Gen Core™ Fanless Edge AI Computer supporting Nvidia® RTX-A2000

• Fanless design (Embedded heat pipes cooling solution)
• 12^th / 13^th Generation Core™ i9/i7/i5/i3 Processor (Alder Lake-S / Raptor Lake-s)
• Up to 60W GPU MXM module expansion
• 4 x 802.3af (15.4W) Gigabit PoE ports (FPC-5211-M4)
• 802.3af (15.4W)/802.3at(25.5W) Gigabit PoE ports (FPC-5211-2M4/2P4)
• DP x2 + HDMI x 1 and DVI x 1 (support 4 independent displays)
• Power on/off delay control / configurable ignition power control
• Supports TPM 2.0 and Time-Sensitive Networking (TSN)
• Two-mPCIe for optional Wi-Fi/3G/4G/GPS or I/O expansion supported
• Front-accessible I/O support
• 1 x M.2 B-Key for storge or 5G / LTE +1 x M.2 E-Key for Wi-Fi / BT
• 1 x M.2 M-Key for NVMe SSD

32GB DDR5 4800 WT ECC SODIMM

• Small Outline Dual In-line Memory Module
• Single Error Correction and Detection Available
• Fully Tested and Optimized for Stability and Performance
• Uses Original IC to Meet Strict Industrial Standards
• On module Power Management IC (JEDEC Standard: 1.1V)
• 30μ” Gold Finger
• Operating Environment: -40°C ~ 95°C (Tc)
• Anti-Sulfuration Protection Against Harsh Environments

16GB DDR5 4800 WT ECC SODIMM

• Small Outline Dual In-line Memory Module
• Single Error Correction and Detection Available
• Fully Tested and Optimized for Stability and Performance
• Uses Original IC to Meet Strict Industrial Standards
• On module Power Management IC (JEDEC Standard: 1.1V)
• 30μ” Gold Finger
• Operating Environment: -40°C ~ 95°C (Tc)
• Anti-Sulfuration Protection Against Harsh Environments

Fanless Embedded System with LGA1700 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor, Intel® H610, 4 COM, 2 LANs, 2 HDMI, 4 USB, 8-CH DIO and 19VDC

• LGA1700 12th gen Intel® Core™ i7/i5/i3, 35W TDP
• Intel® UHD Graphics 770 by Intel® Xe Architecture with up to 32 graphics
• 8-CH DIO
• 2 HDMI for dual display outputs
• -10˚C to +50˚C wide operating temperatures
• 19VDC power input w/power protection
• Cost-effective design