Axiomtek

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

• Cost-effective with fanless and cableless design
• Intel® Atom® Processor E3930
• 6 isolated COM, isolated DIO (8-in/8-out), 3 GbE LAN
• Wide operating temperature range from -40°C to +85°C
• 9 to 36 VDC power input with OVP, UVP, OCP, RPP
• Supports 5G connectivity
• Supports TPM 2.0

• NVIDIA® Jetson™ TX2 with Pascal™, 256 CUDA cores GPU
• High performance AI computing for GPU-accelerated processing
• Ideal for intelligent edge applications, machine learning and computer vision
• Supports M.2 PCIe & SATA SSD and MicroSD slot
• Supports 2 USB 3.1 Gen 1 and 2 COM or 2 CAN
• Wide operating temperature from -30°C to +60°C
• JetPack supported

Fanless Embedded System with LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, Intel® C246, ECC/Non-ECC and 1 PCIex4 Expansion Slot

• Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor
• 2 DDR4 ECC/non-ECC memory supported, up to 64GB
• Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
• DVI-I, HDMI, and DisplayPort with triple-view supported
• 6 GbE LAN, 6 USB 3.1 and 1 PCIe x4 slot
• Flexible I/O window supported

Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO

• LGA1151 socket 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Coffee Lake)
• Supports 2 COM, 6 USB, and 8-CH DI/DO
• Two 2.5" SATA drive bay
• M.2 Key E 2230 for Wi-Fi
• Front I/O connectivity design
• Supports flexible I/O window

Fanless Edge AI System with NVIDIA® Jetson Xavier™ NX, HDMI, GbE LAN, GbE PoE, 2 USB, and Allxon Device Management Solutions

• NVIDIA® Jetson™ Xavier NX with Volta™ GPU architecture with 384 NVIDIA CUDA® cores
• High AI computing performance for GPU-accelerated processing
• 384-core NVIDIA Volta™ GPU with 48 Tensor Cores
• Ideal for edge AI smart city applications
• Supports one 15W GbE PoE for camera
• Wide operating temperature from -30°C to +50°C
• JetPack supported

* NVIDIA® Jetson Nano™ with Maxwell™ GPU architecture with 128 NVIDIA CUDA® cores
* High AI computing performance for GPU-accelerated processing
* Ideal for edge AI smart city applications
* Optional IP42 cover kit for semi-outdoor applications
* Supports one 15W GbE PoE for camera
* Wide operating temperature from -30°C to +60°C
* JetPack supported

Rugged IP67-rated fanless edge AI system with NVIDIA® Jetson Xavier™ NX, 1 HDMI, 1 GbE PoE, 2 USB, and 9 to 36 VDC power input

• IP67-rated design for outdoor edge AI applications
• NVIDIA® Jetson Xavier™ NX with 384-core NVIDIA Volta™ GPU with 48 Tensor Cores
• High AI computing performance for GPU accelerated processing
• -30°C to +50°C operating temperature range
• 9 to 36 VDC wide range power input
• Features M12 lockable I/Os
• 1 IEEE 802.3af Gigabit PoE (15W)

Value-added module with 4 M12 X-coded GbE LAN and PoE

• 4 M12 X-coded PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 M12 X-coded GbE LAN

• 4 M12 X-coded GbE LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 RJ-45 GbE LAN and PoE

• 4 x RJ-45 PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 RJ-45 GbE LAN

• 4 x RJ-45 LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 M12 A-coded GbE LAN and PoE

• 4 x M12 A-coded LAN or PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 certified; CE, LVD and FCC compliant

Value-added Module with 4 M12 A-coded GbE LAN and PoE

• 4 x M12 A-coded LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 certified; CE, LVD and FCC compliant

Value-added Module with 4 BNC Video-in and 1 BNC Audio-in

• 4 BNC Video-in and 1 BNC Audio-in
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 and IEC 60945 certified; CE, LVD and FCC compliant

Value-added Module with 1 Terminal Block Isolated DIO 8-in/8-out

• 1 isolated DIO 8-in/8-out
• Swappable modular design
• Maximize I/O flexibility
• 2kV isolated protection
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added Module with 4 Terminal Block 4-wire Isolated RS-232/422/485

• 4 4-wire Isolated RS-232/422/485
• Swappable modular design
• Maximize I/O flexibility
• 2kV isolated protection
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

2U Rackmount Server with Dual 4th Gen Intel® Xeon® Scalable Processor, Intel® C741 PCH for HPC in Medical Applications

• Dual 4th Gen Intel® Xeon® Scalable processors
• 16 DDR5-4800 ECC registered DIMM
• Supports 2 U.3 SSD, 6 SATA SSD slots
• 1600W redundant power ATX power supply
• Supports DP full HD output
• Supports dual 10G Base-T

Fanless Edge AI System with NVIDIA® Jetson Orin™ NX SoM, 1 x HDMI, 1 x GbE LAN, 1 x GbE PoE and 2 x USB

• NVIDIA® Jetson Orin™ NX with 1024-core NVIDIA Ampere GPU
• High AI computing performance for GPU-accelerated processing
• Ideal for edge AI smart city applications
• Supports one 15W GbE PoE for camera
• Wide operating temperature from -30°C to +50°C
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Fanless Edge AI System with NVIDIA® Jetson™ TX2 NX, HDMI, GbE LAN, GbE PoE, 2 USB, and Allxon Device Management Solutions

• NVIDIA® Jetson™ TX2 NX with Pascal™ architecture GPU with 256 CUDA cores
• High AI computing performance for GPU-accelerated processing
• Ideal for edge AI smart city applications
• Supports one 15W GbE PoE for camera
• Wide operating temperature from -30°C to +60°C
• Supports JetPack
• Supports Allxon Device Management Solutions (Allxon DMS)

ARM-based Fanless Edge AI Computer with Hailo-8™ Processor, HDMI, GbE LAN, COM, DIO, CANbus

• Hailo-8™ AI processor, up to 26 TOPS
• Advanced AI performance, ideal for smart city applications
• Dual GbE for GigE camera and LiDAR connectivity
• Dual COM/Dual CANbus/8-CH DI/DO
• Supports Wi-Fi/Bluetooth/5G/LTE wireless connection
• Wide operating temperature from -20°C to +70°C
• Supports Linux operating system

SDM-S module with Intel® Pentium® processor N4200, onboard DDR4 4GB, EMMC 64GB, 1 LAN , 2 USB 3.0

• Intel® Smart Display Module (Intel® SDM) specification
• Intel® Pentium® processor N4200 & Celeron® processor N3350 (Apollo Lake)
• 4GB LPDDR4 memory onboard (8GB optional)
• 64GB eMMC onboard (32G optional)
• One M.2 Key E 2230 slot
• Two USB 3.0 and one GbE LAN
• Small design for easy integration into slim displays
• Optimized for digital signage, public kiosks, professional monitors, point-of-sale
• Projections for magic mirrors, beside terminals, hospitality, and more

Intel® Smart Display Module Large (Intel® SDM-L) with 8th Gen Intel® Core™ i7/i5/i3, Intel® Celeron® Processor, HDMI and LAN

• Intel® Smart Display Module (Intel® SDM) specification
• 8th gen Intel® Core™ i7/i5/i3 or Intel® Celeron® processor (Whiskey Lake-U)
• 2 DDR4-2400 SO-DIMM for up to 32G of memory
• M.2 Key E slot
• M.2 Key M slot
• M.2 Key B slot
• One HDMI, four USB 3.0, and LAN
• Supports Intel® AMT 12

Intel® Smart Display Module Large (Intel® SDM-L) with 8th Gen Intel® Core™ i7/i5/i3, Intel® Celeron® Processor, HDMI and LAN

• Intel® Smart Display Module (Intel® SDM) specification
• 8th gen Intel® Core™ i7/i5/i3 or Intel® Celeron® processor (Whiskey Lake-U)
• 2 DDR4-2400 SO-DIMM for up to 32G of memory
• M.2 Key E slot
• M.2 Key M slot
• M.2 Key B slot
• One HDMI, four USB 3.0, and LAN
• Supports Intel® AMT 12

• Robust DIN-rail fanless embedded system with i.MX 6UL processor, 2 COM, 2 LANs and DIO (2-in/1-out)

• RISC-based (i.MX 6UltraLite) processor 528 MHz
• 256MB DDR3 SDRAM onboard
• 4GB eMMC flash onboard
• 1 PCI Express Mini Card slot (Wi-Fi or 3G/4G)
• 2 digital inputs and 1 digital output
• Power input range of 9V to 48V DC with terminal block
• Embedded embedded Linux operating system (Yocto)
• Fanless and compact design
• Wide operating temperature range from -40°C to +70°C

• Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 1 COM, 1 LAN, DIO (4-in/4-out) and CANbus

• RISC-based (i.MX 6UltraLite) processor 528 MHz
• 256MB DDR3L SDRAM onboard
• 4GB eMMC flash onboard
• 2 PCI Express Mini Card slots (Wi-Fi or 3G/4G)
• 4 digital inputs and 4 digital outputs
• Power input range of 9V to 48V DC with terminal block
• Embedded Linux (Yocto) operating system
• Fanless and compact design
• Wide operating temperature range from -40°C to +70°C