Teollisuus PC

External Fan with 2x 4pin Terminal Block Plug and Mounting Bracket, Support Smart Fan Function

• Cincoze GM-series
• 18.7Watts, 12V DC
• Dimension: 220mm x 200mm x 19.8mm

1U Rackmount Network Appliance support Intel® Gen8 Xeon® E-2378, 4 DDR4 slots, 8 x 2.5GbE , 2 PulM slots , 2 PCIe expansion, Redundant Power

•   Intel® Gen8 Xeon® E-2378
• DDR4 3200MHz ECC/Non-ECC UDIMM , up to 128G
• 8 x 2.5 Gbps RJ-45 LAN ports & 2 pairs LAN bypass
• 2 x Standard PCIe slot (1 x PCIe Gen4 x4, 1 x PCIe Gen4 x8)
• 2 x PulM network module
• 1 x RJ-45 Console, 2 x USB 3.0
• 2 x 2.5” SATA HDD/SSD bay support SATA 3.0 (6 Gbps)
• 300W Redundant Power Supply

1U Rackmount Network Appliance with Intel Ice Lake-D LCC processor

•  Intel® Xeon® D Processor series (Code Name: Ice Lake-D LCC)
• 4 x DDR4 2400M/2933Hz ECC UDIMM/RDIMM, up to 256G
• 8 x 2.5 Gbps RJ-45 LAN ports & 5 x 10 Gbps SFP+ ports
• 1 x FH PCIe Gen4 x8 or 2 x FH PCIe Gen4 x4 and 1 x OCP 3.0 slot
• 1 x RJ-45 Console, 2 x USB 3.0, LCM
• 2 x 2.5” SATA slot, 2 x M.2 M key 2280 (SATA/PCIe Gen3 x2)
• 1 x M.2 B key for IPMI module (support IEI iRIS2 IPMI module)
• 320W Redundant Power Supply

2U Rackmount Network Appliance with Intel® Xeon® Scalable processors

• Dual 4th Gen Intel® Xeon® Scalable processors (Code name: Sapphire Rapids)
• DDR5 4800 MHz ECC RDIMM (up to 4 TB)
• 1 x PCIe Gen 4 x16 FHFL
• 8 x OCP 3.0 slots (6 x PCIe Gen 5 x16, 2 x PCIe Gen 4 x16)
• 2 x 10GbE SFP+ (Intel X710-BM2)
• 2 x 1GbE RJ45 (Intel i350-AM2)
• 1 x GbE RJ45 IPMI management port
• 2 x U.2 slots with Removable Tray (PCIe 4.0 x4)
• 1 x 2280 M-Key (PCIe 4.0 x4)
• Redundant power supply (CRPS)

AI System Based on NVIDIA® Jetson AGX Orin™

• Compact fanless design
• Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
• Supports 4 x GbE (optional PoE), 4 x USB 3.2 Gen 2 (10 Gbit/s)
• Supports 2 x mPCIe, 2 x Nano SIM slots
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

Rugged IP67-rated fanless edge AI system with NVIDIA® Jetson Xavier™ NX, 1 HDMI, 1 GbE PoE, 2 USB, and 9 to 36 VDC power input

• IP67-rated design for outdoor edge AI applications
• NVIDIA® Jetson Xavier™ NX with 384-core NVIDIA Volta™ GPU with 48 Tensor Cores
• High AI computing performance for GPU accelerated processing
• -30°C to +50°C operating temperature range
• 9 to 36 VDC wide range power input
• Features M12 lockable I/Os
• 1 IEEE 802.3af Gigabit PoE (15W)

Value-added module with 4 M12 X-coded GbE LAN and PoE

• 4 M12 X-coded PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 M12 X-coded GbE LAN

• 4 M12 X-coded GbE LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 RJ-45 GbE LAN and PoE

• 4 x RJ-45 PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 RJ-45 GbE LAN

• 4 x RJ-45 LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 M12 A-coded GbE LAN and PoE

• 4 x M12 A-coded LAN or PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 certified; CE, LVD and FCC compliant

Value-added Module with 4 M12 A-coded GbE LAN and PoE

• 4 x M12 A-coded LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 certified; CE, LVD and FCC compliant

Value-added Module with 4 BNC Video-in and 1 BNC Audio-in

• 4 BNC Video-in and 1 BNC Audio-in
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 and IEC 60945 certified; CE, LVD and FCC compliant

Value-added Module with 1 Terminal Block Isolated DIO 8-in/8-out

• 1 isolated DIO 8-in/8-out
• Swappable modular design
• Maximize I/O flexibility
• 2kV isolated protection
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added Module with 4 Terminal Block 4-wire Isolated RS-232/422/485

• 4 4-wire Isolated RS-232/422/485
• Swappable modular design
• Maximize I/O flexibility
• 2kV isolated protection
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

2U Rackmount Server with Dual 4th Gen Intel® Xeon® Scalable Processor, Intel® C741 PCH for HPC in Medical Applications

• Dual 4th Gen Intel® Xeon® Scalable processors
• 16 DDR5-4800 ECC registered DIMM
• Supports 2 U.3 SSD, 6 SATA SSD slots
• 1600W redundant power ATX power supply
• Supports DP full HD output
• Supports dual 10G Base-T

CMI Module with 2x Intel 10GbE LAN, RJ45 Port

•  2x Intel X550 10GbE LAN

Fanless Edge AI System with NVIDIA® Jetson Orin™ NX SoM, 1 x HDMI, 1 x GbE LAN, 1 x GbE PoE and 2 x USB

• NVIDIA® Jetson Orin™ NX with 1024-core NVIDIA Ampere GPU
• High AI computing performance for GPU-accelerated processing
• Ideal for edge AI smart city applications
• Supports one 15W GbE PoE for camera
• Wide operating temperature from -30°C to +50°C
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Intel Celeron N3350 DC SoC with 4K Dual HDMI/Dual LAN/M.2 DIN-Rail Fanless Box PC

• Intel Celeron N3350 Dual Core 1.1 GHz
• DIN-Rail system with essential I/O ports on front-side bezel
• I-Grade 4G DDR3L memory and 64G SSD built-in
• Windows 10 IoT Enterprise built-in
• 60W adaptor bundled in the accessory box
• Dual HDMI display up to 4K resolution
• 1 x full-size mPCIe with SIM holder and 1 x M.2 2230 for WIFI
• 12V ~ 28V wide range power input
• -30 ~ 70 °C extended operating temperature
• Advantech WISE-PaaS/DeviceOn support

Fanless Edge AI System with NVIDIA® Jetson™ TX2 NX, HDMI, GbE LAN, GbE PoE, 2 USB, and Allxon Device Management Solutions

• NVIDIA® Jetson™ TX2 NX with Pascal™ architecture GPU with 256 CUDA cores
• High AI computing performance for GPU-accelerated processing
• Ideal for edge AI smart city applications
• Supports one 15W GbE PoE for camera
• Wide operating temperature from -30°C to +60°C
• Supports JetPack
• Supports Allxon Device Management Solutions (Allxon DMS)

ARM-based Fanless Edge AI Computer with Hailo-8™ Processor, HDMI, GbE LAN, COM, DIO, CANbus

• Hailo-8™ AI processor, up to 26 TOPS
• Advanced AI performance, ideal for smart city applications
• Dual GbE for GigE camera and LiDAR connectivity
• Dual COM/Dual CANbus/8-CH DI/DO
• Supports Wi-Fi/Bluetooth/5G/LTE wireless connection
• Wide operating temperature from -20°C to +70°C
• Supports Linux operating system

SDM-S module with Intel® Pentium® processor N4200, onboard DDR4 4GB, EMMC 64GB, 1 LAN , 2 USB 3.0

• Intel® Smart Display Module (Intel® SDM) specification
• Intel® Pentium® processor N4200 & Celeron® processor N3350 (Apollo Lake)
• 4GB LPDDR4 memory onboard (8GB optional)
• 64GB eMMC onboard (32G optional)
• One M.2 Key E 2230 slot
• Two USB 3.0 and one GbE LAN
• Small design for easy integration into slim displays
• Optimized for digital signage, public kiosks, professional monitors, point-of-sale
• Projections for magic mirrors, beside terminals, hospitality, and more

Intel® Smart Display Module Large (Intel® SDM-L) with 8th Gen Intel® Core™ i7/i5/i3, Intel® Celeron® Processor, HDMI and LAN

• Intel® Smart Display Module (Intel® SDM) specification
• 8th gen Intel® Core™ i7/i5/i3 or Intel® Celeron® processor (Whiskey Lake-U)
• 2 DDR4-2400 SO-DIMM for up to 32G of memory
• M.2 Key E slot
• M.2 Key M slot
• M.2 Key B slot
• One HDMI, four USB 3.0, and LAN
• Supports Intel® AMT 12

Intel® Smart Display Module Large (Intel® SDM-L) with 8th Gen Intel® Core™ i7/i5/i3, Intel® Celeron® Processor, HDMI and LAN

• Intel® Smart Display Module (Intel® SDM) specification
• 8th gen Intel® Core™ i7/i5/i3 or Intel® Celeron® processor (Whiskey Lake-U)
• 2 DDR4-2400 SO-DIMM for up to 32G of memory
• M.2 Key E slot
• M.2 Key M slot
• M.2 Key B slot
• One HDMI, four USB 3.0, and LAN
• Supports Intel® AMT 12

• Robust DIN-rail fanless embedded system with i.MX 6UL processor, 2 COM, 2 LANs and DIO (2-in/1-out)

• RISC-based (i.MX 6UltraLite) processor 528 MHz
• 256MB DDR3 SDRAM onboard
• 4GB eMMC flash onboard
• 1 PCI Express Mini Card slot (Wi-Fi or 3G/4G)
• 2 digital inputs and 1 digital output
• Power input range of 9V to 48V DC with terminal block
• Embedded embedded Linux operating system (Yocto)
• Fanless and compact design
• Wide operating temperature range from -40°C to +70°C

• Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 1 COM, 1 LAN, DIO (4-in/4-out) and CANbus

• RISC-based (i.MX 6UltraLite) processor 528 MHz
• 256MB DDR3L SDRAM onboard
• 4GB eMMC flash onboard
• 2 PCI Express Mini Card slots (Wi-Fi or 3G/4G)
• 4 digital inputs and 4 digital outputs
• Power input range of 9V to 48V DC with terminal block
• Embedded Linux (Yocto) operating system
• Fanless and compact design
• Wide operating temperature range from -40°C to +70°C

Mini-PCIe Module with 2x LAN Ports, 2x 30cm cable / 1x Universal Bracket with 2x RJ45 Cutout

• GPU Expansion Box with 2x PCIe x 16 (Signal PCIe x 8), 1x PCIe x 4 and 1 x PCIe x 1 Slots for GP-3000 Series

• GPU Expansion Box with 1x PCIex16 and 1x PCIe x4 Slots for GP-3000 Series

AI System Based on NVIDIA Jetson® AGX Xavier

• Fanless compact design
• Embedded with NVIDIA® Jetson™ AGX Xavier up to 32 TOPS
• Supports 2 x GbE, 2 x USB 3.0, 2 x USB 2.0, 2 x RS-232/422/485
• Supports 1 x mPCIe, 1 x M.2 2280 (PCIe x2 NVMe), PCIe Add-on Card
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

AI Inference System Based on NVIDIA® Jetson Nano™

• Fanless compact design
• Embedded with NVIDIA® Jetson™ NANO up to 472 GOPS
• Supports 2 x GbE, 1 x USB 3.0 , 1 x USB 2.0
• Supports 1 x mPCIe, 1 x M.2 2280 (SATA interface)
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

Mini PCI-e 4-port RS-232/422/485 serial board with power input

• Single-Lane (x1) PCI-Express with throughput up to 5.0 / 2.5Gbps
• Fully compliant with PCI-Express Base Specification Rev 2.0
• Top serial transmission performance up to 921.6 Kbps baud rate
• FIFO 256 Bytes, 15 KV ESD protections on board
• H/W, S/W automate flow control supported
• RS-232/422/485 mode selectable by DIP switch setting
• Each port supports 5V or 12V power output by DIP switch setting

• Onboard Intel® Celeron® N3350 Processor
• Supports Triple Independent Display
• Supports PoE+ Function (with optional CFM module)
• Supports CMI Interface for I/O Expandability
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 1x SIM Card Socket
• Ultra Compact Size (150 x 105 x 52.3 mm)
• Wide Operating Temperature -40°C to 70°C
• Safety: LVD EN62368-1