Teollisuus PC

Fanless Embedded System with Intel® Core™ i5-8365UE/Celeron® 4305UE Processor, HDMI/DisplayPort++, 2 GbE LAN, 2 COM, 4 USB and 12VDC Power Input

• 8th gen Intel® Core™ and Celeron® processor onboard (Whisky Lake-U )
• One M.2 Key E 2230 for Wi-Fi module
• 260-pin DDR4-2400 SO-DIMM, max. up to 32GB
• 2 GbE LAN and 2 USB 3.1 Gen2
• Supports DisplayPort++ and HDMI for dual independent displays
• Multiple mounting designs: Wall mount, DIN-rail and VESA mount

Fanless Edge AI Vision System with Hailo-8™ Processor, HDMI, GbE LAN, COM, USB 3.2, DIO, and Wi-Fi/Bluetooth/5G/LTE Wireless Connection

• Hailo-8™ AI processor, up to 26 TOPS
• Palm size with high AI computing performance
• Supports dual GbE LAN for cameras
• Supports Wi-Fi/Bluetooth/5G/LTE wireless connection
• Wide operating temperature from -10°C to +60°C
• Wide voltage input from 12 to 24 VDC
• Supports Windows 10 and Linux
• Ideal for edge AI smart city applications

Fanless Embedded System with LGA1200 Socket 10th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® W480E, HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC

• LGA1200 10th gen Intel® Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
• Dual 2.5" SATA HDD drive bays with RAID 0 &1
• 2 HDMI and DisplayPort for triple view
• TPM 2.0 onboard
• AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Pentiium® processor N4200 CPU
• 4 Isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• 4 NON-Isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• 4 isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU

• Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
• 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
• 2x full-size Mini PCIe sockets for module expansion
• 2x front-accessible SIM card slots for signal redundancy
• Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
• Optional CFM modules (power ignition sensing, or 4x PoE)
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

Mini Vision System with Intel Atom® x5-E3940 Processor, Vision I/O, 2-CH PoE and 2-CH LED Output

• Integrated real-time vision I/O
  2-CH trigger input
  2-CH trigger output
  2-CH LED lighting control
  4-CH isolated DIO
• Supports camera interfaces
  2 IEEE802.3af GbE LAN ports (PoE)
• Power input: 24 VDC
• -10°C to +55°C operating temperature range
• Supports TPM 2.0 function

Fanless edge AI system with NVIDIA® Jetson Xavier™ NX SoM, 1 HDMI, 1 GbE LAN, 4 GbE PoE, 8-CH DI/DO, and 2 COM/CAN for 5G and AMR applications

• NVIDIA® Jetson Xavier™ NX with Volta™ GPU architecture with 384 NVIDIA CUDA® cores
• Advanced edge AI platform for AMR, AGV and computer vision
• Wide power input range of 12V/24VDC with ignition power control
• Supports four GbE PoE for GigE camera and LiDAR connectivity
• Wide operating temperature from -30°C to +60°C
• One M.2 Key B slot for 5G/LTE
• One 8-CH DI/DO & Two DB9 for RS-232/422/485/CAN

Industrial System with LGA1200 Socket Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 Processors, Intel® W480E, Front-access I/O and PCIe Slots

• Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 processors, up to 80W
• Intel® W480E chipset
• NVIDIA® RTX3090 GPU card support
• Supports M.2 Key B slot for 5G wireless connection
• Supports M.2 Key E slot for Wi-Fi connection
• Supports RAID 0,1
• Supports power-on delay function
• Supports TPM 2.0

• 11th Gen Intel® Core® i7/i5/i3 processor (Tiger Lake U), 15W
• Flexible I/O module for further expansion
• M.2 Key E socket for wireless connection
• 2 DisplayPort
• Supports TPM 2.0
• Supports Intel® iAMT
• Optional 1 PCIe x4 slot expansion kit
• Optional DIN-rail, bookshelf and wall mount

• NVIDIA® Jetson AGX Xavier™ with 512-core Volta GPU with 64 Tensor cores GPU
• High AI computing performance for GPU-accelerated processing
• Ideal for intelligent edge applications, AGV, AMR and computer vision
• Supports M.2 NVMe PCIe x4 SSD slot
• Wide operating temperature from -30°C to +50°C
• JetPack supported

• DIN-rail design with fanless and noiseless design
• Intel Atom® x5-E3930 processor (Apollo Lake)
• One DDR3L-1866 SO-DIMM for up to 8GB of memory
• Four GbE RJ-45 (Intel® i211)
• PCI Express Mini Card slot for wireless module
• Supports 2 COM, 4 GbE LAN, 2 USB 3.0 and 1 HDMI
• Suitable ICS cybersecurity/critical infrastructure protection

9th/8th Gen Intel® Xeon®/Core™ GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor (35W / 65W / 80W)
• 2 x DDR4 SO-DIMM Sockets, Supports ECC/non ECC type up to 2666 MHz, 64GB
• 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm)
• 1 x M.2 M Key Socket (NVMe), 1 x M.2 E Key Socket (CNVi)
• 2 x Front Accessible SIM Card Slots for Signal Redundancy
• CMI Technology for Various I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Versatile Mounting Methods (Wall / Stand / Face-up / 19" Rack Mount)
• Military Standard Shock & Vibration Proof

• Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
• 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
• Triple Independent Display (DVI-I, DisplayPort)
• Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
• 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
• Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
• Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
• Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
• Cincoze MEC Module Kits for Various I/O Expansion
• 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
• Wide Operating Temperature (-40°C to 70°C)
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13, No. 10R-0514273) Certified for In-vehicle Application

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

2-slot Industrial System with LGA1151 Socket 8th/9th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q370, Front-access I/O, PCIe and PCI Slots

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

2-slot Industrial System with LGA1151 Socket 8th/9th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q370, Front-access I/O, PCIe and PCI Slots

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

• Cost-effective with fanless and cableless design
• Intel® Atom® Processor E3930
• 6 isolated COM, isolated DIO (8-in/8-out), 3 GbE LAN
• Wide operating temperature range from -40°C to +85°C
• 9 to 36 VDC power input with OVP, UVP, OCP, RPP
• Supports 5G connectivity
• Supports TPM 2.0

• Onboard Intel® Pentium® N4200 Processor
• Supports Triple Independent Display
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Function (with optional CFM modules)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 2x SIM Card Socket
• Compact Size (185 x 131 x 56.5 mm)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13, No. 10R-0515075), LVD EN60950-1

• Onboard Intel® Atom® / Pentium® Processor
• 1x DDR3L SO-DIMM max. up to 8GB
• Triple Independent Display (1x CDS, 1x VGA, 1x DisplayPort)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• Rich I/O (2x LAN, 4x USB, 4x COM, 8x Isolated DIO)
• 2x Full Size Mini-PCIe Expansion Socket
• Supports 2x PoE+ Function (with optional CFM module)
• Supports Ignition Sensing Function (IGN) (with optional CFM module)
• Supports CDS Technology for Convertible Panel PC
• Built-in Two 2W Internal Speakers

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 2x PCI/PCIe Slots for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 9/8th Gen Intel® Core™  35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 1x PCI/PCIe Slot for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Fanless compact design
• Embedded with NVIDIA® Jetson™ Xavier NX up to 21 TOPS
• Supports 2 x GbE, 1 x USB 3.0 , 1 x USB 2.0
• Supports 1 x mPCIe, 1 x M.2 2280 (SATA interface)
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

• NVIDIA® Jetson™ TX2 with Pascal™, 256 CUDA cores GPU
• High performance AI computing for GPU-accelerated processing
• Ideal for intelligent edge applications, machine learning and computer vision
• Supports M.2 PCIe & SATA SSD and MicroSD slot
• Supports 2 USB 3.1 Gen 1 and 2 COM or 2 CAN
• Wide operating temperature from -30°C to +60°C
• JetPack supported

Fanless Embedded System with LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, Intel® C246, ECC/Non-ECC and 1 PCIex4 Expansion Slot

• Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor
• 2 DDR4 ECC/non-ECC memory supported, up to 64GB
• Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
• DVI-I, HDMI, and DisplayPort with triple-view supported
• 6 GbE LAN, 6 USB 3.1 and 1 PCIe x4 slot
• Flexible I/O window supported

9th/8th Gen Intel® Xeon®/Core™ Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor up to 8 cores
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion
• 2x DDR4 SO-DIMM sockets, up to 2666MHz, 64GB
• Supports wide operating temperature (-40°C - 70°C) and vibration/shock tolerance (5G/50G)
• 260 mm x 200 mm x 85 mm compact footprint
• Flexible functionality expansions:
  - M.2 E key (CNVi), full-size Mini-PCIe and M.2 M Key (NVMe SSD)
  - Proprietary CMI interface for various I/O expandability
  - Proprietary CFM interface for PoE+ or Power Ignition Sensing

Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO

• LGA1151 socket 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Coffee Lake)
• Supports 2 COM, 6 USB, and 8-CH DI/DO
• Two 2.5" SATA drive bay
• M.2 Key E 2230 for Wi-Fi
• Front I/O connectivity design
• Supports flexible I/O window

Industrial Mini PCIe USB Expansion Card

• Single-Lane (x1) PCI-Express with throughput up to 5.0/2.5Gbps
• Fully compliant with PCI-Express Base Specification Rev 2.0 Two USB 3.2 Super-Speed ports
• USB data transfer rate of 1.5/12/480/5000 Mbps
• Support simultaneous operation of multiple USB 1.1, USB 2.0, and USB 3.2 GEN1x1 devices
• Universal Serial Bus 3.2 specification Revision 1.0 compliant
• Support Hot-Swap function

   

9/8th Generation Intel® Xeon® and Core™ Processors, Extreme Performance, Compact and Modular Rugged Workstation

• Supports 9/8th Gen Intel® Xeon® and Core™ Octa/Hexa-core Processor
• Triple Independent Display with 4K/2K UHD Resolution (HDMI / DP / DVI-I)
• 2x 2.5" Hot Swap SATA HDD/SSD Tray, 3x mSATA Socket
• 2x USB 3.1 (10Gb/s) for Ultimate Data-transfer Speed
• 1x M.2 E Key Socket (CNVi), 3x Full-size Mini-PCIe Socket, 1x SIM Card Socket
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Sensing (with optional CFM modules)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13 No.10R-0515210), LVD EN62368-1, EN50121-3-2