Tietotekniikka

21.5" TFT-LCD Sunlight Readable Display Module with Projected Capacitive Touch

• 21.5" TFT-LCD with Projected Capacitive Touch
• Brightness up to 1,000 nits
• Resolution up to 1920 x 1080 (Full HD)
• 50,000 hrs LED Backlight Life
• Wide Range Operating Temperature 0°C to 80°C
• IP 65 Compliant Front Panel
• Flat Rugged Aluminum Die-casting Bezel
• Convertible Display System (CDS) Technology Supported
• Safety: UL, cUL, CB, IEC, EN 62368-1

PCIe x16 Dual-port 100G QSFP+ Ethernet Network Adapter(E810)

• Intel master chip scheme
• PCI Express v4.0 x16
• iWARP and RoCEv2 Remote Direct Memory Access (RDMA)
• Intel Ethernet Adaptive Virtual Function
• Enhanced server virtualizations: 256 VFs, 768 VSIs
• IEEE 1588 Precision Time Protocol with per-packet time stamping

4 xU.2 to PCIe x16 Adapter for 2.5

• 4 68-pin SFF-8639 interface connector
• Support Equipment: 4 PCIe U.2 NVMe SSD
• Ps. Motherboards and BIOS Support PCIe Bifurcation required

1U Rackmount Network Appliance support Intel® Gen8 Xeon® E-2378, 4 DDR4 slots, 8 x 2.5GbE , 2 PulM slots , 2 PCIe expansion, Redundant Power

•   Intel® Gen8 Xeon® E-2378
• DDR4 3200MHz ECC/Non-ECC UDIMM , up to 128G
• 8 x 2.5 Gbps RJ-45 LAN ports & 2 pairs LAN bypass
• 2 x Standard PCIe slot (1 x PCIe Gen4 x4, 1 x PCIe Gen4 x8)
• 2 x PulM network module
• 1 x RJ-45 Console, 2 x USB 3.0
• 2 x 2.5” SATA HDD/SSD bay support SATA 3.0 (6 Gbps)
• 300W Redundant Power Supply

PCIe x4 to U.3 NVMe SSD Adapter

• PCIe 4.0 x4 to U.3 NVMe SSD Adapter
• Support：1* U.3 NVMe SSD
• Host Bus Type： PCIe 4.0 x4

1U Rackmount Network Appliance with Intel Ice Lake-D LCC processor

•  Intel® Xeon® D Processor series (Code Name: Ice Lake-D LCC)
• 4 x DDR4 2400M/2933Hz ECC UDIMM/RDIMM, up to 256G
• 8 x 2.5 Gbps RJ-45 LAN ports & 5 x 10 Gbps SFP+ ports
• 1 x FH PCIe Gen4 x8 or 2 x FH PCIe Gen4 x4 and 1 x OCP 3.0 slot
• 1 x RJ-45 Console, 2 x USB 3.0, LCM
• 2 x 2.5” SATA slot, 2 x M.2 M key 2280 (SATA/PCIe Gen3 x2)
• 1 x M.2 B key for IPMI module (support IEI iRIS2 IPMI module)
• 320W Redundant Power Supply

2U Rackmount Network Appliance with Intel® Xeon® Scalable processors

• Dual 4th Gen Intel® Xeon® Scalable processors (Code name: Sapphire Rapids)
• DDR5 4800 MHz ECC RDIMM (up to 4 TB)
• 1 x PCIe Gen 4 x16 FHFL
• 8 x OCP 3.0 slots (6 x PCIe Gen 5 x16, 2 x PCIe Gen 4 x16)
• 2 x 10GbE SFP+ (Intel X710-BM2)
• 2 x 1GbE RJ45 (Intel i350-AM2)
• 1 x GbE RJ45 IPMI management port
• 2 x U.2 slots with Removable Tray (PCIe 4.0 x4)
• 1 x 2280 M-Key (PCIe 4.0 x4)
• Redundant power supply (CRPS)

Industrial 2.5" U.2 SSD, Wide-Temp,  iSLC, iDataGuard, iPowerGuard

• PCIe Gen. 4x4, NVMe 1.4
• Excellent data transfer speed
• Support iSLC technology
• Standard temperature
• iPowerguard
• iDataguard
• LDPC ECC engine supported.
• End-to-end Data Path Protection (ETEP)

Industrial 2.5" U.2 SSD, Wide-Temp,  iSLC, iDataGuard, iPowerGuard

• PCIe Gen. 4x4, NVMe 1.4
• Excellent data transfer speed
• Support iSLC technology
• Standard temperature
• iPowerguard
• iDataguard
• LDPC ECC engine supported.
• End-to-end Data Path Protection (ETEP)

Industrial 2.5" U.2 SSD, Wide-Temp,  iSLC, iDataGuard, iPowerGuard

• PCIe Gen. 4x4, NVMe 1.4
• Excellent data transfer speed
• Support iSLC technology
• Standard temperature
• iPowerguard
• iDataguard
• LDPC ECC engine supported.
• End-to-end Data Path Protection (ETEP)

Industrial 2.5" U.2 SSD, Wide-Temp,  iSLC, iDataGuard, iPowerGuard

• PCIe Gen. 4x4, NVMe 1.4
• Excellent data transfer speed
• Support iSLC technology
• Standard temperature
• iPowerguard
• iDataguard
• LDPC ECC engine supported.
• End-to-end Data Path Protection (ETEP)

 PCIe x16 to 4-Port M.2 NVMe SSD Adapter- Low Profile

• Interface Type:4*M.2 Connectors
• Support Equipment:4*M.2 NVMe PCIe 4.0 SSD for 2260,2280 and 22110mm
• Ps. Motherboards and BIOS Support PCIe Bifurcation required

PCIe x1 Single-port Gigabit SFP Ethernet Network Adapter  (Realtek RTL8111H Based)

Dual 10GbE Low Profile Ethernet Card (0℃~+55℃) with PoE+ Module, PCIex4

AI System Based on NVIDIA® Jetson AGX Orin™

• Compact fanless design
• Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
• Supports 4 x GbE (optional PoE), 4 x USB 3.2 Gen 2 (10 Gbit/s)
• Supports 2 x mPCIe, 2 x Nano SIM slots
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

Rugged IP67-rated fanless edge AI system with NVIDIA® Jetson Xavier™ NX, 1 HDMI, 1 GbE PoE, 2 USB, and 9 to 36 VDC power input

• IP67-rated design for outdoor edge AI applications
• NVIDIA® Jetson Xavier™ NX with 384-core NVIDIA Volta™ GPU with 48 Tensor Cores
• High AI computing performance for GPU accelerated processing
• -30°C to +50°C operating temperature range
• 9 to 36 VDC wide range power input
• Features M12 lockable I/Os
• 1 IEEE 802.3af Gigabit PoE (15W)

LGA1700 12th/13th Generation Intel® Core™ i9/i7/i5/i3 ATX Motherboard with DP/HDMI/VGA, DDR4, USB 3.2, M.2

• Intel® 12th/13th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipset
• Four DIMM sockets up to 128 GB DDR4 3200
• Triple display DP/HDMI/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2
• Advantech iBMC remote out-of-band power management solution on DeviceOn
• Qualified for AWS (Amazon Web Service) IoT Greengrass
• Note 1: Legacy platform is not supported.

Intel Atom x6000E Series PICO-ITX SBC

• Intel Atom x6000E Series
• Onboard LPDDR4x up to 8GB and EMMC up to 128GB
• Support 12-24V wide voltage range -40~85°C operating temperature
• 2x GbE LAN, 2x USB3.2, 2x RS-232/422/485, I2C
• M.2 E-Key, M.2 B-Key for SATA storage and option to support RS-232 module
• Support iManager & Software APIs, WISE-DeviceOn, and EdgeAI Suite

M.2 2280 dual isolated CAN bus 2.0B Board (-40℃~+85℃)

• CAN bus 2.0B backward compatible with 2.0A
• Compliant with ISO 11898
• Support baud rate 10/20/50/100/ 125/250/500/800/1000K
• Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Support Card ID and Silent mode setting by switch
• Support port to computer isolation 2.5kV
• Support CAN message acceptance filter

Industrial M.2 2280 Embedded Module with iPowerguard, iDataguard

• PCIe Gen4 x4, NVMe SSD
• Kioxia 3D TLC NAND
• Standard/Wide-temperature
• iPowerguard
• iDataguard
• Dynamic Thermal Management
• Hybrid Write Mode with SLC Cache Enable
• Support write protection

Industrial M.2 2280 Embedded Module with iPowerguard, iDataguard

• PCIe Gen4 x4, NVMe SSD
• Kioxia 3D TLC NAND
• Standard/Wide-temperature
• iPowerguard
• iDataguard
• Dynamic Thermal Management
• Hybrid Write Mode with SLC Cache Enable
• Support write protection

Industrial M.2 2280 Embedded Module with iPowerguard, iDataguard

• PCIe Gen4 x4, NVMe SSD
• Kioxia 3D TLC NAND
• Standard/Wide-temperature
• iPowerguard
• iDataguard
• Dynamic Thermal Management
• Hybrid Write Mode with SLC Cache Enable
• Support write protection

Industrial M.2 2280 Embedded Module with iPowerguard, iDataguard

• PCIe Gen4 x4, NVMe SSD
• Kioxia 3D TLC NAND
• Standard/Wide-temperature
• iPowerguard
• iDataguard
• Dynamic Thermal Management
• Hybrid Write Mode with SLC Cache Enable
• Support write protection

32GB DDR5 4800 WT ECC SODIMM

• Small Outline Dual In-line Memory Module
• Single Error Correction and Detection Available
• Fully Tested and Optimized for Stability and Performance
• Uses Original IC to Meet Strict Industrial Standards
• On module Power Management IC (JEDEC Standard: 1.1V)
• 30μ” Gold Finger
• Operating Environment: -40°C ~ 95°C (Tc)
• Anti-Sulfuration Protection Against Harsh Environments

• NVIDIA® Quadro® A1000 with MXM 3.1 TYPE A form factor (82 x 70 mm)
• Up to 2048 CUDA cores , 16 RT cores and 64 Tensor cores, 6.66 TFLOPS
• GDDR6 4GB memory, 128-bit, bandwidth 224 GB/s
• Up to 4 x DisplayPort 1.4a outputs
• Long life cycle, supports 5 years availability

• NVIDIA® Quadro® A500 with MXM 3.1 TYPE A form factor (82 x 70 mm)
• Up to 2048 CUDA cores , 16 RT cores and 64 Tensor cores, 6.54 TFLOPS
• GDDR6 4GB memory, 64-bit, bandwidth 112 GB/s
• Headless design, support MS-Hybrid mode only
• Long life cycle, supports 5 years availability

MXM 3.1 Type B+ NVIDIA® Quadro® Embedded A4500 with DP 1.4a

• NVIDIA® Quadro® A4500 with MXM 3.1 TYPE B+ form factor(82 x 105 mm)
• Up to 5888 CUDA cores , 46 RT cores and 184 Tensor cores, 17.66 TFLOPS
• GDDR6 16GB memory, 256-bit, bandwidth 512 GB/s
• Up to 4 x DisplayPort 1.4a outputs
• Long life cycle, supports 5 years availability

Value-added module with 4 M12 X-coded GbE LAN and PoE

• 4 M12 X-coded PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 M12 X-coded GbE LAN

• 4 M12 X-coded GbE LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• CE, LVD, FCC and EN 50155 compliant

Value-added Module with 4 RJ-45 GbE LAN and PoE

• 4 x RJ-45 PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 RJ-45 GbE LAN

• 4 x RJ-45 LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added module with 4 M12 A-coded GbE LAN and PoE

• 4 x M12 A-coded LAN or PoE/PoE+
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 certified; CE, LVD and FCC compliant

Value-added Module with 4 M12 A-coded GbE LAN and PoE

• 4 x M12 A-coded LAN
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 certified; CE, LVD and FCC compliant

Value-added Module with 4 BNC Video-in and 1 BNC Audio-in

• 4 BNC Video-in and 1 BNC Audio-in
• Swappable modular design
• Maximize I/O flexibility
• Designed for tBOX300/500 series
• EN 50155 and IEC 60945 certified; CE, LVD and FCC compliant

Value-added Module with 1 Terminal Block Isolated DIO 8-in/8-out

• 1 isolated DIO 8-in/8-out
• Swappable modular design
• Maximize I/O flexibility
• 2kV isolated protection
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

Value-added Module with 4 Terminal Block 4-wire Isolated RS-232/422/485

• 4 4-wire Isolated RS-232/422/485
• Swappable modular design
• Maximize I/O flexibility
• 2kV isolated protection
• Designed for tBOX300/500 series
• LVD, FCC, EN 50155 and IEC 60945 certified; CE compliant

2U Rackmount Server with Dual 4th Gen Intel® Xeon® Scalable Processor, Intel® C741 PCH for HPC in Medical Applications

• Dual 4th Gen Intel® Xeon® Scalable processors
• 16 DDR5-4800 ECC registered DIMM
• Supports 2 U.3 SSD, 6 SATA SSD slots
• 1600W redundant power ATX power supply
• Supports DP full HD output
• Supports dual 10G Base-T