Tietotekniikka

M.2 2242 to single isolated CAN bus Module

• Compliant with PCI Express 1.1
• Meet the Requirements of the ISO 11898-1
• CAN bus 2.0B backward compatible with 2.0A
• Support baud rate 10/20/50/100/250/500/800/1000K
• Support CAN message acceptance filter
• Support Linux SocketCAN
• Compliant with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection
• Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Termination resistor enabled/disabled by switch
• Industrial Temperature (-40°C to +85°C) support

• Support CANopen high layer protocol
• Support baud rate 100/125/250/500(default)/800/1000K
• Support CAN message acceptance filter
• Keep configuration after hardware reboot
• Up to 6000 CAN messages per second (receive data)
• Support Listen-only mode
• Additional driver to support Linux SocketCAN
• Termination resistor enabled/disabled by jumper
• Complies with EN61000-4-5 2.5kV Surge protection
• Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection
• Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Supports 3^rd mounting hole and USB Pin header for out-of minicard installation
• Supports -40 to +85 degrees

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

ATX Motherboard with LGA1200 Socket 10th Gen Intel® Core™ i9/i7/i5/i3, Xeon® E Processor, Intel® W480E, ECC DDR4, USB 3.2 Gen2, NVMe, Dual LAN, VGA, DisplayPort++, DVI-D, and HDMI

• LGA1200 socket 11th/10th gen Intel® Core™ i9/i7/i5/i3, Xeon® E, Pentium® or Celeron® processor (Comet Lake and Rocket Lake)
• Four 288-pin DDR4-2933 (CML)/3200 (RKL) ECC/non-ECC un-buffered Long-DIMM, up to 128GB
• DisplayPort++, VGA, DVI-D and HDMI with triple-view supported
• Supports M.2 Key M 2280
• 2 USB 3.2 Gen2 and 4 USB 3.2 Gen1
• TPM 2.0 supported (optional)

2-slot Industrial System with LGA1151 Socket 8th/9th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q370, Front-access I/O, PCIe and PCI Slots

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

2-slot Industrial System with LGA1151 Socket 8th/9th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q370, Front-access I/O, PCIe and PCI Slots

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

• LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
• Supports RAID 0,1 (Intel® Q370)
• Supports Power-on delay function
• Supports TPM 2.0
• Supports AMT 12 (Intel® Q370)

• 21.5" Full-HD kapasitiivinen kosketusnäyttö teollisuuskäyttöön
• HDMI, DVI ja VGA sisääntulot. USB-kosketuspinta.
• Alumiininen kotelointi. IP65 suojattu etupaneeli.
• VESA-kiinnitys. Upotusasennettavissa.
• Natiiviresoluutio 1920x1080. Kuvasuhde 16:9.
• Valovoimakkuus 350nits.
• Käyttölämpötila -10C - 60C.
• Käyttöjännite DC12V.

Fanless Embedded System, Intel Celeron J4125 (4-Core) CPU, 2xDisplayPort, HDMI, 2x GbE LAN, 6x USB, COM

• Onboard Intel Celeron J4125 Quad Core
• Three monitor support (2x DisplayPort , 1x HDMI)
• 5G/4G LTE & WLAN support
• Small size, Fanless system (144mm x 127mm)

• Cost-effective with fanless and cableless design
• Intel® Atom® Processor E3930
• 6 isolated COM, isolated DIO (8-in/8-out), 3 GbE LAN
• Wide operating temperature range from -40°C to +85°C
• 9 to 36 VDC power input with OVP, UVP, OCP, RPP
• Supports 5G connectivity
• Supports TPM 2.0

T376 Family
Industrial 2.5" SATA SSD

• Compliant with SATA III 6.0Gb/s (backward compatible to 1.5Gb/s and 3Gb/s)
• 3D TLC NAND flash memory
• Capacity: 128GB ~ 1TB
• Powerguard Function (Power Loss Protection)
• Write Protect Function (Optional)
• Support AES 256-bit Encryption
• With DRAM Buffer
• SLC write cache technology
• Operating as boot disk
• Product includes Standard Temperature range & Wide Temperature range
• Low power consumption
• Shock resistance and anti-vibration
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command
• Fully compatible with Windows 7, Windows 8, Windows 10, Mac OS, and Linux

T376 Family
Industrial 2.5" SATA SSD

• Compliant with SATA III 6.0Gb/s (backward compatible to 1.5Gb/s and 3Gb/s)
• 3D TLC NAND flash memory
• Capacity: 128GB ~ 1TB
• Powerguard Function (Power Loss Protection)
• Write Protect Function (Optional)
• Support AES 256-bit Encryption
• With DRAM Buffer
• SLC write cache technology
• Operating as boot disk
• Product includes Standard Temperature range & Wide Temperature range
• Low power consumption
• Shock resistance and anti-vibration
• Static and dynamic wear leveling
• Bad block management
• S.M.A.R.T. & TRIM command
• Fully compatible with Windows 7, Windows 8, Windows 10, Mac OS, and Linux

• Onboard Intel® Pentium® N4200 Processor
• Supports Triple Independent Display
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Function (with optional CFM modules)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 2x SIM Card Socket
• Compact Size (185 x 131 x 56.5 mm)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13, No. 10R-0515075), LVD EN60950-1

• Intel Q370 core logic
• Support 8th & 9th generation Intel FCLGA1151 low power CPU
• Support SODIMM DDR4 2666/2400Mhz max 32GB
• On-board gigabit LAN and six USB 3.1 ports
• On-board DVI-I and Display Port
• Optional dual mini-PCIe slots support one full size and one half size mini card
• Support 6Gb/s SATA 2.5" hard disk
• Support SATA slim optical disk drive
• Power-on delay and remote power on/off
• Dimension W146mm x L250mm x H42mm

• Intel Q370 core logic
• Support 8th & 9th generation Intel FCLGA1151 low power CPU
• Support SODIMM DDR4 2666/2400Mhz max 32GB
• On-board gigabit LAN and six USB 3.1 ports
• On-board DVI-I and Display Port
• Optional dual mini-PCIe slots support one full size and one half size mini card
• Support 6Gb/s SATA 2.5" hard disk
• Support SATA slim optical disk drive
• Power-on delay and remote power on/off
• Dimension W146mm x L250mm x H42mm

• Onboard Intel® Atom® / Pentium® Processor
• 1x DDR3L SO-DIMM max. up to 8GB
• Triple Independent Display (1x CDS, 1x VGA, 1x DisplayPort)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• Rich I/O (2x LAN, 4x USB, 4x COM, 8x Isolated DIO)
• 2x Full Size Mini-PCIe Expansion Socket
• Supports 2x PoE+ Function (with optional CFM module)
• Supports Ignition Sensing Function (IGN) (with optional CFM module)
• Supports CDS Technology for Convertible Panel PC
• Built-in Two 2W Internal Speakers

• Supports 9/8th Gen Intel® Core™ 35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 2x PCI/PCIe Slots for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Supports 9/8th Gen Intel® Core™  35W/65W LGA 1151 Processors
• 2x DDR4 SO-DIMM Socket, Supports Up to 2666MHz, 64GB
• Triple Independent Displays: 1x DVI-I and 2x DP (4K Resolution)
• 1x M.2 2280 M Key Socket, Auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
• 2x Front Accessible SIM Card Slots for Signal Redundancy
• 1x PCI/PCIe Slot for Add-on Cards (Maximum Length: 235 mm)
• 4x CMI Slots for Modular I/O Expansions
• 1x CFM Slot for Power Ignition Sensing Function
• Wide Operating Temperature (-40°C to 70°C )
• EN50121-3-2 Certified/ LVD EN62368-1

• Fanless compact design
• Embedded with NVIDIA® Jetson™ Xavier NX up to 21 TOPS
• Supports 2 x GbE, 1 x USB 3.0 , 1 x USB 2.0
• Supports 1 x mPCIe, 1 x M.2 2280 (SATA interface)
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

• NVIDIA® Jetson™ TX2 with Pascal™, 256 CUDA cores GPU
• High performance AI computing for GPU-accelerated processing
• Ideal for intelligent edge applications, machine learning and computer vision
• Supports M.2 PCIe & SATA SSD and MicroSD slot
• Supports 2 USB 3.1 Gen 1 and 2 COM or 2 CAN
• Wide operating temperature from -30°C to +60°C
• JetPack supported

● 24” fanless FHD medical grade panel PC

● Intel® Core™ i5-6300U (Skylake) processor

● Certification: CE,FCC Class B Part18, IEC 60601-1:2005+AMD1:2012 ( Edition 3.1), IEC 60601-1-2: 2014 (Edition 4.0)

● PCAP touch allows multi-touch, multi-layer gloves and water on screen operation

● Anti-bacteria housing with IP65 front bezel and IP32 rear cover protection

● E-Window expansion slot

● Compact small edge device with great computing & graphic performance

● 6th/7th Gen Intel® Xeon & Core™ processor platform with Intel® C236 chipset

● Dual SODIMM ECC & non-ECC unbuffered Memory supported up to 64GB

● PCIe [x16] slot supports for Nvidia GPU, IEI Mustang Acceleration Card

● PCIe [x4] slot supports for capture card or other application

● Medical grade with high performance fanless embedded computing

● 6th Gen Intel® Core™ processor platform with Intel® HM170 chipset and DDR4 memory

● Safety / EMC: CE, FCC class B part 18, IEC 60601-1 V3.1, IEC 60601-1-2 V4.0, IEC 62304, ISO 14971

● Triple independent display with high resolution support

● Isolated COM ports for enhancing safety among devices

● Optional PCIe x16 expansion slot supports more flexible functions

• 10.1" Full-HD kosketusnäyttö.
• 320nits
• 1920x1200 natiiviresoluutio
• HDMI ja VGA-liitännät
• USB-liitäntä kosketuspinnalle (kapasitiivinen)
• Kevyt rakenne. VESA-75 sekä kamerakierre näytön reunoilla.
• Käyttöjännite DC 12V, 230V AC-verkkovirtalähde mukana.

• HUOM! Jalusta on optio!

• 10.1" Full-HD monitori.
• 320nits
• 1920x1200 natiiviresoluutio
• HDMI ja VGA-liitännät
• Kevyt rakenne. VESA-75, kamerakierre näytön reunoilla. 
• Käyttöjännite DC12V, mukana 230V AC-verkkovirtalähde.
• HUOM! Jalusta on optio, ostettava erikseen.

Fanless Embedded System with LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, Intel® C246, ECC/Non-ECC and 1 PCIex4 Expansion Slot

• Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor
• 2 DDR4 ECC/non-ECC memory supported, up to 64GB
• Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
• DVI-I, HDMI, and DisplayPort with triple-view supported
• 6 GbE LAN, 6 USB 3.1 and 1 PCIe x4 slot
• Flexible I/O window supported

9th/8th Gen Intel® Xeon®/Core™ Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor up to 8 cores
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion
• 2x DDR4 SO-DIMM sockets, up to 2666MHz, 64GB
• Supports wide operating temperature (-40°C - 70°C) and vibration/shock tolerance (5G/50G)
• 260 mm x 200 mm x 85 mm compact footprint
• Flexible functionality expansions:
  - M.2 E key (CNVi), full-size Mini-PCIe and M.2 M Key (NVMe SSD)
  - Proprietary CMI interface for various I/O expandability
  - Proprietary CFM interface for PoE+ or Power Ignition Sensing

Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO

• LGA1151 socket 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Coffee Lake)
• Supports 2 COM, 6 USB, and 8-CH DI/DO
• Two 2.5" SATA drive bay
• M.2 Key E 2230 for Wi-Fi
• Front I/O connectivity design
• Supports flexible I/O window