Tietotekniikka

• Cost-effective with fanless and cableless design
• Intel® Pentiium® processor N4200 CPU
• 4 Isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

• Cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• 4 NON-Isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

21.5" FULL-HD Sun-Readable TFT Touch monitor (PCAP)

• 1000nits Hi-Brightness
• Auto-Dimming
• IP65 front panel
• 16:9 Wide-screen (1920*1080)
• PCAP 10-point multitouch (USB)
• Metal frame, Aluminium front panel
• VESA75/100, Panel mounting
• HDMI, VGA, RCA, audio input

• 15.6" FULL-HD TFT LCD kosketusnäyttö.
• IP65-suojattu etupaneeli.
• Kuvasuhde 16:9.
• PCAP kosketuspinta (USB).
• Alumiininen kuori ja runko, erittäin tukeva ja kestävä rakenne.
• VESA 75/100, sopii upotus- ja paneeliasennettavaksi.
• Laaja käyttölämpötila -10C - +60C.
• Helposti puhdistettava.
• HDMI, VGA, DVI ja audio I/O.

• 15" TFT LCD kosketusnäyttö.
• IP65-suojattu etupaneeli.
• Kuvasuhde 4:3.
• PCAP kosketuspinta (USB).
• Alumiininen kuori ja runko, erittäin tukeva ja kestävä rakenne.
• VESA 75/100, sopii upotus- ja paneeliasennettavaksi.
• Laaja käyttölämpötila -10C -60C.
• Helposti puhdistettava.
• HDMI, VGA, DVI ja audio I/O.

• 12" TFT LCD kosketusnäyttö.
• IP65-suojattu etupaneeli.
• Kuvasuhde 4:3.
• PCAP kosketuspinta (USB).
• Alumiininen kuori ja runko, erittäin tukeva ja kestävä rakenne.
• VESA 75/100, sopii upotus- ja paneeliasennettavaksi.
• Laaja käyttölämpötila -10C -60C.
• Helposti puhdistettava.
• HDMI, VGA, DVI ja audio I/O.

• Intel® Atom™ processor E3827, 1.75GHz
• Dual SIM cards + dual WWAN modules support
• Wide operating temperature -30°C ~ 70°C
• Built-in CAN 2.0B. Optional CAN/OBDII module (CAN Bus 2.0B or OBDII SAE J1939)
• 4 x mini-PCIe socket rich expansion capability
• Wake on RTC/SMS via WWAN module
• Voice communication via WWAN module
• Compliant with MIL-STD-810G
• Built-in U-blox M8N GPS, optional dead reckoning support

• Intel Atom® x5-E3940 processor quad core 1.6GHz
• Built-in Hailo AI module
• Built-in U-blox M8N GPS, optional dead reckoning support
• Built-in CAN 2.0B. optional OBD2 SAE J1708/SAE J1939
• 2 x PoE support, total 60W (VTC 1021-CHIoT only)
• 2 x RJ45 10/100/1000 Fast Ethernet with LED
• 3 x DI and 3 x DO support
• Smart power management with ignition on/off delay via software control and low voltage protection
• Variety of wireless communication options
• Certified by CE/FCC/E13 mark

• Cost-effective with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• 4 isolated COM, 4 USB, 2 GbE LAN
• 8-bit programmable DIO for IoT gateway applications
• Wide operating temperature range from -40°C to +70°C
• 12 to 24 VDC wide range power input
• OVP, UVP, OCP, RPP power protection design
• AMS.AXView intelligent remote monitoring software for IIoT

Mini-ITX SBC with FCLGA1200 10th Gen Intel® Core™ i9/i7/i5/i3, DisplayPort++, HDMI, VGA, eDP, USB 3.2, M.2 and Dual GbE LAN

• Pressurized compact chassis (less dust)
• 10th Gen Intel Core Cpu
• Front IO design
• Economical, Industrial durability

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU

• Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
• 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
• 2x full-size Mini PCIe sockets for module expansion
• 2x front-accessible SIM card slots for signal redundancy
• Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
• Optional CFM modules (power ignition sensing, or 4x PoE)
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

10.1” WXGA total IP66 design plastic panel PC, NXP iMX8M Quad Plus Processor, DDR4 4GB on board, 32GB eMMC, ISOBUS connectors, with projected capacitive touch, wide range 9~60V DC power input

• 10.1” LCD Panel, optional high brightness LED backlight LCD
• NXP i.MX8M Quad Plus Processor
• Fanless design
• Total IP66 with isolated ISOBUS connectors
• Operating system: Android 10.0
• Wide range DC 9~60V power input
• CE/FCC/E Mark

Mini Vision System with Intel Atom® x5-E3940 Processor, Vision I/O, 2-CH PoE and 2-CH LED Output

• Integrated real-time vision I/O
  2-CH trigger input
  2-CH trigger output
  2-CH LED lighting control
  4-CH isolated DIO
• Supports camera interfaces
  2 IEEE802.3af GbE LAN ports (PoE)
• Power input: 24 VDC
• -10°C to +55°C operating temperature range
• Supports TPM 2.0 function

12.1" WXGA TFT IP66 & IP69K-rated Stainless Steel Fanless PCT (or Resistive Touch) Panel Computer with Intel® Core™ i5-7300U Processor and Flat Bezel Design (-20°C to +50°C)

• 12.1" TFT flat bezel LCD display
• IP66/IP69K-rated (NEMA 4X) water/dust/corrosion-proof design
• Full stainless steel enclosure with SUS 316
• -20°C to +50°C wide operating temperature range
• Fanless design with Intel® Core™ i5-7300U processor
• Optional Wi-Fi/3G kit for wireless network connectivity
• 9 to 36 VDC wide range power input
• Supports VESA mount
• M12 type connectors for harsh environments

15.6" FHD TFT IP66 & IP69K-rated Stainless Steel Fanless PCT (or Resistive Touch) Panel Computer with Intel® Core™ i5-7300U Processor and Flat Bezel Design (-20°C to +50°C)

• 15.6" FHD TFT flat bezel LCD display
• IP66/IP69K-rated (NEMA 4X) water/dust/corrosion-proof design
• Full stainless steel enclosure with SUS 316
• -20°C to +50°C wide operating temperature range
• Fanless design with Intel® Core™ i5-7300U processor
• Optional Wi-Fi/3G kit for wireless network connectivity
• 9 to 36 VDC wide range power input
• Supports VESA mount
• M12 type connectors for harsh environments

Fanless edge AI system with NVIDIA® Jetson Xavier™ NX SoM, 1 HDMI, 1 GbE LAN, 4 GbE PoE, 8-CH DI/DO, and 2 COM/CAN for 5G and AMR applications

• NVIDIA® Jetson Xavier™ NX with Volta™ GPU architecture with 384 NVIDIA CUDA® cores
• Advanced edge AI platform for AMR, AGV and computer vision
• Wide power input range of 12V/24VDC with ignition power control
• Supports four GbE PoE for GigE camera and LiDAR connectivity
• Wide operating temperature from -30°C to +60°C
• One M.2 Key B slot for 5G/LTE
• One 8-CH DI/DO & Two DB9 for RS-232/422/485/CAN

3.5” Embedded SBC with 11th Gen Intel® Core™ i7/i5/i3, Celeron® Processor, DisplayPort++, HDMI, LVDS, 1 GbE LAN and 2.5 GbE LAN

• 11th gen Intel® Core™ i7/i5/i3 & Celeron® Processor
• 2 DDR4 SO-DIMM for up to 64GB of memory
• GbE LAN and 2.5 GbE LAN ports
• 3 M.2 expansion slot

11th Gen. Intel® Core U-series i7/i5/i3/Celeron 3.5" SBC w/ MIOe

• 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W
• Dual Channel DDR4-3200 up to 64GB
• 4 simultaneous displays: LVDS/ eDP*, HDMI, DP, USB Type-C
• 2 GbE, 4 USB3.1, CAN Bus, DC-in 12-24V
• Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe) , MIOe
• Supports iManager, WISE-PaaS/RMM, SW API, and Edge AI Suite

• 8th Gen. Intel Core Processor with Quad/Dual Cores, TDP 15W
• Dual Channel DDR4-2400 up to 32GB, onboard eMMC up to 64GB
• Triple simultaneous displays by 48-bit LVDS/eDP+HDMI+DP
• 2 GbE, 4 USB3.1, CAN Bus, M.2 M-Key 2280 supports NVMe, DC-in 12-24V
• Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite

9th/8th Gen. Intel® Xeon®/Core™ Processor, 3.5" SBC w/ MIOe

• 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W
• Dual channel DDR4-2400, up to 64GB, ECC for Xeon SKU
• Triple simultaneous displays with 48-bit LVDS+HDMI+DP
• USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD
• Dual GbE, SATAIII, RS-232/422/485, CANBus, SMBus, I2C
• M.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230
• Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite

11th Gen. Intel® Core U-series i7/i5/i3/Celeron Pico-ITX SBC

• Intel® Tiger Lake-UP3 (10nm++) Series, On-board LPDDR4x-4266 up to 32G with IBECC
• Dual independent display: eDP/MIPI-DSI, DP up to 8K
• Rich I/O interface with GbE x 2, USB 3.2, COM Port, DIO SMBus, TPM2.0
• Flexible expansion to IoT connectivity: M.2 E-Key, M.2 B-Key/M-Key NVMe x2
• Supports Advantech iManager3.0, Embedded Software APIs, WISE-DeviceOn, and Edge AI Suite

Industrial System with LGA1200 Socket Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 Processors, Intel® W480E, Front-access I/O and PCIe Slots

• Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 processors, up to 80W
• Intel® W480E chipset
• NVIDIA® RTX3090 GPU card support
• Supports M.2 Key B slot for 5G wireless connection
• Supports M.2 Key E slot for Wi-Fi connection
• Supports RAID 0,1
• Supports power-on delay function
• Supports TPM 2.0

• 11th Gen Intel® Core® i7/i5/i3 processor (Tiger Lake U), 15W
• Flexible I/O module for further expansion
• M.2 Key E socket for wireless connection
• 2 DisplayPort
• Supports TPM 2.0
• Supports Intel® iAMT
• Optional 1 PCIe x4 slot expansion kit
• Optional DIN-rail, bookshelf and wall mount

Mini-ITX SBC with FCLGA1200 10th Gen Intel® Core™ i9/i7/i5/i3, DisplayPort++, HDMI, VGA, eDP, USB 3.2, M.2 and Dual GbE LAN

• Intel® H410 chipset
• 2 DDR4 SO-DIMM for up to 64GB memory
• 2 USB 3.2 Gen1 and 5 USB 2.0
• 6 COM port
• 1 PCIe x16 and 1 M.2 Key E slot
• 1 Full-size mini-PCIe slot
• 2 SATA-600
• 1 M.2 Key B for USB 3.2 interface 5G module

• Supports 7/6th Generation Intel® Xeon® / Core™ LGA1151 Socket Type Processors
• Intel® C236 Chipset
• 2x DDR4-2133/2400 SO-DIMM Sockets, up to 64GB Memory
• Triple Independent Display (1x DVI-I, 2x DisplayPort)
• 2x 2.5" Hot Swap SATA III HDD/SSD bays, Supports RAID 0/1
• 3x CMI Interfaces for RJ45/M12 GbE LAN, COM & DIO Expansions
• 2x CFM Interfaces for Power Ignition Sensing and PoE Functions
• 4x Full-size Mini-PCIe Slots for Wireless & I/O Expansions
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13) Certification for In-vehicle Application

• NVIDIA® Jetson AGX Xavier™ with 512-core Volta GPU with 64 Tensor cores GPU
• High AI computing performance for GPU-accelerated processing
• Ideal for intelligent edge applications, AGV, AMR and computer vision
• Supports M.2 NVMe PCIe x4 SSD slot
• Wide operating temperature from -30°C to +50°C
• JetPack supported

Medical Grade System with 9th/8th Gen Intel® Core™ i7/i5 Processor for Smart Healthcare Applications

• Intel® Xeon® & 8th Gen Intel® i7/i5/i3 processors (Coffee Lake), TDP 45W
• 2 DDR4-2400 SO-DIMM for up to 64GB memory
• 1 HDMI and 2 DisplayPort++ with 4K UHD supported
• 2 COM and 2 GbE LAN support 4kV isolation
• Supports half-size PCI Express x16 slot
• Swappable 2.5" SATAIII SSD tray with security lock

• Intel® Celeron® processor N3350
• 4GB On-board LPDDR4
• 1 GbE LAN
• On-board eMMC 64GB
• M.2 Key E

• 15" XGA TFT LCD display with LED backlight
• Fanless design with Intel® Celeron® processor N3350 or Intel® Pentium® processor N4200
• 2 GbE LAN, 4 USB and 2 COM
• IP65-rated plastic front bezel
• External AT/ATX mode selection switch
• Easy access storage & RAM design
• Supports panel mount, wall mount, VESA arm and desktop stand
• RS-232/422/485 with RI/5V/12V selectable by BIOS
• Programmable OSD function key

• DIN-rail design with fanless and noiseless design
• Intel Atom® x5-E3930 processor (Apollo Lake)
• One DDR3L-1866 SO-DIMM for up to 8GB of memory
• Four GbE RJ-45 (Intel® i211)
• PCI Express Mini Card slot for wireless module
• Supports 2 COM, 4 GbE LAN, 2 USB 3.0 and 1 HDMI
• Suitable ICS cybersecurity/critical infrastructure protection

9th/8th Gen Intel® Xeon®/Core™ GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

• Supports 9th/8th Gen Intel® Xeon®/Core™ Processor (35W / 65W / 80W)
• 2 x DDR4 SO-DIMM Sockets, Supports ECC/non ECC type up to 2666 MHz, 64GB
• 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm)
• 1 x M.2 M Key Socket (NVMe), 1 x M.2 E Key Socket (CNVi)
• 2 x Front Accessible SIM Card Slots for Signal Redundancy
• CMI Technology for Various I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Versatile Mounting Methods (Wall / Stand / Face-up / 19" Rack Mount)
• Military Standard Shock & Vibration Proof

• Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
• 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
• Triple Independent Display (DVI-I, DisplayPort)
• Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
• 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
• Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
• Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
• Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
• Cincoze MEC Module Kits for Various I/O Expansion
• 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
• Wide Operating Temperature (-40°C to 70°C)
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13, No. 10R-0514273) Certified for In-vehicle Application

M.2 2242 to single isolated CAN bus Module

• Compliant with PCI Express 1.1
• Meet the Requirements of the ISO 11898-1
• CAN bus 2.0B backward compatible with 2.0A
• Support baud rate 10/20/50/100/250/500/800/1000K
• Support CAN message acceptance filter
• Support Linux SocketCAN
• Compliant with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection
• Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Termination resistor enabled/disabled by switch
• Industrial Temperature (-40°C to +85°C) support

• Support CANopen high layer protocol
• Support baud rate 100/125/250/500(default)/800/1000K
• Support CAN message acceptance filter
• Keep configuration after hardware reboot
• Up to 6000 CAN messages per second (receive data)
• Support Listen-only mode
• Additional driver to support Linux SocketCAN
• Termination resistor enabled/disabled by jumper
• Complies with EN61000-4-5 2.5kV Surge protection
• Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection
• Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Supports 3^rd mounting hole and USB Pin header for out-of minicard installation
• Supports -40 to +85 degrees

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN
• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
• 2x PCI/PCIe expansion slots
• 3x full-size Mini PCIe sockets, 2x SIM card slots
• Optional CMI modules for I/O expansion
• Optional CFM modules for ignition sensing & PoE
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)